Plating catalyst liquid, plating method, and method for producing laminate having metal film

Abstract

A plating catalyst liquid which places little burden on the environment, which does not roughen the surface of a plating target, which can be easily controlled for the amount of plating catalyst applied and which is at low risk of inflammation and is highly safe, and a plating method using the plating catalyst are provided. The plating catalyst liquid includes a palladium compound, water, and a water-soluble combustible liquid serving as a combustible liquid ingredient, has a flash point of 40° C. or more and contains the water-soluble combustible liquid in an amount of 0.1 to 40 wt %.

Description

TECHNICAL FIELD[0001]The present invention relates to a plating catalyst liquid, a plating method using the plating catalyst liquid and a method for producing a laminate having a metal film with the use of the plating catalyst liquid.BACKGROUND ART[0002]Recently, the technique of forming a metal film by plating on a surface of a material has been utilized in various fields for functional or decorative purposes. For example, the resin moldings such as automobile parts are plated with metals such as copper and nickel to add a touch of class and an aesthetic value thereto. In addition, the technique of obtaining a desirably patterned metal film after the formation of a metal film by plating on an insulating film is widely used to manufacture electronic components and semiconductor devices. This technique is used in, for example, printed circuit boards employed in electronic devices and electromagnetic interference shielding films employed in plasma displays.[0003]A “substractive” proce...

AI Technical Summary

Benefits of technology

[0015]In view of the situation as described above, an object of the invention is to provide a plating catalyst liquid which places little burden on the environment, which does not roughen the surface of a plating target, which can be easily controlled for the amount of plating catalyst applied and which is at low risk of inflammation and is highly safe. Another object of the invention is to provide a plating method using the plating catalyst.Solution to Problems

[0036]The invention can provide a plating catalyst liquid which ensures high work safety, which places little burden on the environment, which does not roughen the surface of a plating target, and which can be highly controlled for the amount of plating catalyst applied, thus leading to excellent wiring formability, and which is not included in the hazardous materials defined in the Category IV under the Fire Service Act, and a plating method using the plating catalyst.

Problems solved by technology

Therefore, when used as metal wiring, the metal pattern suffered from poor radio frequency characteristics due to the irregularities at the interface between the metal pattern and the substrate.

What is more, roughening of the substrate surface required treatment of the substrate surface with a strong acid such as chromic acid, which complicated the step and led to environmental problems such as liquid waste disposal.

On the other hand, the graft polymer has a polar group in this method and therefore moisture is easily absorbed or removed due to temperature or humidity changes and as a result the metal film formed or the substrate may be deformed.

In addition, in cases where a substrate modified with such a polar group-containing graft polymer is used to perform substrate metalization, a fault due to water absorption in the electrical wiring manufacturing process and an electrical fault of electrical wiring itself may occur.

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