Heat Dissipating device

Abstract

A heat dissipating device includes a casing having a compartment. At least one heat conducting board is mounted in the compartment and divides the compartment into first and second chambers. The first chamber includes a plurality of openings. At least one fan unit is mounted in the first chamber and includes at least one air inlet and at least one air outlet. The air inlet is in communication with a first one of the plurality of openings. The air outlet is in communication with a second one of the plurality of openings. By utilizing the heat conducting board to absorb the heat generated by electronic elements in the second chamber and by creating airflow in the first chamber with the fan unit, the temperature of the second chamber and the electronic elements is lowered while preventing moisture or dust from entering the first chamber.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat dissipating device and, more particularly, to a heat dissipating device that can operate without adverse affect by moisture, dust, etc.[0003]2. Description of the Related Art[0004]Electronic elements, such as microprocessors, chips, etc., of most electronic products are generally concentrated and mounted in a casing. However, the temperature in a generally sealed inner chamber of the casing rises more rapidly as the functions and operating speed of the electronic elements upgrade. Heat dissipating devices, such as fans or heat sinks, are provided to dissipate heat to maintain normal operation of the electronic elements at an appropriate temperature and to prolong the service lives of the electronic elements.[0005]FIGS. 1 and 2 show a conventional heat dissipating device including a casing 7 and two fan units 8. Specifically, the casing 7 includes a compartment 71 receiving a plura...

AI Technical Summary

Benefits of technology

[0006]An objective of the present invention is to provide a heat dissipating device that can operate without adverse affect by moisture, dust, etc, prolonging the service lives of electronic elements.

[0008]A further objective of the present invention is to provide a heat dissipating device that provides a heat conducting board to increase a heat exchange area with the electronic elements for enhancing the overall heat dissipating efficiency.

[0010]By utilizing the heat conducting board to absorb the heat generated by the electronic elements in the second chamber and by creating airflow in the first chamber with the fan unit, the temperature of the second chamber and the electronic elements is lowered. Furthermore, the electronic elements will not be moistened or contaminated by moisture, dust, or the like, prolonging the service life and enhancing stability of an electronic product utilizing the electronic elements.

Problems solved by technology

However, moisture, dust, etc. contained in the ambient air enters the compartment 71 together with the air, moistening the electronic elements 9 and causing short circuit or even damage to the electronic elements 9.

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