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Method for Encapsulating a Device in a Microcavity

a microcavity and device technology, applied in the field of encapsulation, can solve the problems of affecting the quality of microstructured devices, so as to achieve the effect of increasing yield or reliability, reducing the risk of damage, and increasing protection

Inactive Publication Date: 2010-08-19
INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW) +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides improved methods of manufacturing semiconductor devices by providing methods of encapsulation that have low temperature budgets, good mechanical properties, and can provide more protection against inadvertent contamination of the micro cavity. The methods involve forming a sacrificial layer, depositing a metal layer over the sacrificial layer, and then removing the sacrificial layer through the metal layer using a porous layer. The porous layer can be sealed to form a cavity. The methods can be used for manufacturing semiconductor devices such as MEMS or NEMS devices, micro accelerometers, micro gyroscopes, and micro switches. The methods can also provide cost savings and increased reliability of the semiconductor devices.

Problems solved by technology

The encapsulation has to be performed without the deposition of sealing material on the MEMS device, which can cause damage to the device.
Moreover, most of these atmospheric pressure techniques do not prevent material deposition inside the cavity.
Etching openings moreover requires patterning, masking steps etc which complicate the whole process of encapsulation.

Method used

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Embodiment Construction

[0047]The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn on scale for illustrative purposes. The dimensions and the relative dimensions do not correspond to actual reductions to practice of the invention.[0048]Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.[0049]It is to be noticed that the term “comprisin...

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Abstract

Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.

Description

FIELD OF THE INVENTION[0001]The present invention is related to methods of manufacturing semiconductor devices, (especially to methods of encapsulation) and to such devices. Particular embodiments relate to microelectronic process technology, to Micro- and Nano-Electro Mechanical Systems (MEMS and NEMS) process and encapsulation or packaging technology, to methods for the 0-Level or wafer level packaging or encapsulation objects for instance MEMS devices. Such encapsulation can cause a cavity, in which an object can be located, such as to be hermetically sealed.BACKGROUND[0002]Many micro-electromechanical systems (MEMS) require an encapsulation under vacuum or under a controlled atmosphere and pressure in order to ensure either a good performance or an acceptable lifetime of operation. The encapsulation has to be performed without the deposition of sealing material on the MEMS device, which can cause damage to the device.[0003]The most popular approach is based on wafer bonding. Her...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/56
CPCB81C2203/0145B81C1/00293
Inventor WITVROUW, ANNVAN HOOF, CHRISFRANSAER, JANCELIS, JEAN-PIERRERICO, RAQUEL CONSUELO HELLINMUSCAT, ANTHONY JOSEPH
Owner INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)
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