Inspection of underfill in integrated circuit package
a technology of integrated circuits and which is applied in the direction of gas flame welding apparatus, instruments, image data processing, etc., can solve the problems of reliability issues of ic packages, and achieve the effect of effective and efficient inspection of underfill materials
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[0031]FIG. 4 shows a system 200 for properly dispensing underfill material during manufacture of an IC package. The system 200 includes a soldering unit 202, a pre-heater 204, an underfill dispenser 206, a post-heater 208, an inspection unit 210, and an underfill curing unit 212. FIG. 5 shows a flow-chart of steps during operation of the system 200 of FIG. 4.
[0032]FIG. 6 shows an example IC package 300, such as a flip-chip IC package for example, processed through the system 200 of FIG. 4. The IC package 300 of FIG. 6 includes a package substrate 302 that supports pins 304 for providing electrical coupling to nodes of an integrated circuit (IC) die 306. Contact balls 308 and contact pads 310 on the substrate 302 couple such nodes of the integrated circuit die 306 to the pins 304 of the substrate 302.
[0033]The soldering unit 202 couples the contact balls 308 from the IC die 306 to the contact pads 310 of the substrate 302. For example, the contact balls 308 are soldered to the contac...
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