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Method of electrochemically fabricating multilayer structures having improved interlayer adhesion

a multi-layer structure and electrochemical technology, applied in the field of three-dimensional structure formation, can solve the problems of destructive separation of masking material from substrate, and achieve the effect of improving the properties of fabricated structures

Inactive Publication Date: 2005-03-03
UNIV OF SOUTHERN CALIFORNIA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0037] It is an object of at least one aspect of the invention to provide an electrochemical fabrication technique that yields improved properties of fabricated structures.
[0039] It is an object of at least one aspect of the invention to provide a heat treated structure having significantly improved interlayer adhesion while not significantly reducing the yield strength of the intra-layer material.
[0041] It is an object of at least one aspect of the invention to provide a heat treated structure having improved properties where the structure remains protected by a sacrificial material until it is time for use.

Problems solved by technology

The CC mask plating process is distinct from a “through-mask” plating process in that in a through-mask plating process the separation of the masking material from the substrate would occur destructively.

Method used

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  • Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
  • Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
  • Method of electrochemically fabricating multilayer structures having improved interlayer adhesion

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Experimental program
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first embodiment

[0097]FIG. 6 depicts a block diagram of the invention where a multilayer three-dimensional structure is formed and then heat treated such that, for example, interlayer adhesion is improved. Element 152 of FIG. 6 calls for the formation of a multi-layer structure from a plurality of adhered layers. This formation process may involve one of the electrochemical fabrication processes discussed above, one of the fabrication processes incorporated herein by reference or some other fabrication process that results in layers being formed on previously formed layers and adhered thereto. After formation of the structure the process moves forward to element 154 which calls for the supplying of a heat treatment to the structure such that interlayer adhesion, for example, is enhanced. The heat treatment may be applied by a heating system such as that illustrated in FIG. 5, or it may be applied in a different manner. The heat treatment is applied at a temperature and for a time that results in a ...

second embodiment

[0098]FIG. 7 depicts a block diagram of the invention where the formation of a multilayer three-dimensional structure includes an operation to planarize deposited layers of material and wherein the structure is subjected to heat treatment after formation. Element 162 of FIG. 7 calls for the formation of a three-dimensional structure which includes a plurality of adhered layers. The formation process will include the depositing of at least one material onto a substrate or previously formed layer such that at least a portion of the layer is formed. Then at least a portion of the deposited material is removed to obtain a planarized surface that may form an outward facing portion of the structure or alternatively it may form a surface onto which additional material may be adhered. Planarization may occur for example by lapping, polishing, chemical mechanical polishing, milling, diamond fly cutting, or the like. After the depositing and removing of material to form a first layer or porti...

third embodiment

[0099]FIG. 8 depicts a block diagram of the invention wherein the formation of a multi-layer structure includes subsequently patterned layers of material that are adhered directly to immediately preceding patterned layers of material and wherein the structure is subjected to heat treatment after formation. Element 172 of FIG. 8 calls for the formation of a three-dimensional structure from a plurality of adhered layers. The first operation involves the forming of a first layer from a deposit of at least one material where the material has a patterned configuration. The material may be deposited in a patterned manner or it may be deposited in a blanket fashion where patterning occurs after deposition. The formation of the first layer may include the deposition of a second material or further materials, it may also include removal operations for the purpose of patterning or the purpose of planarization, and / or it may also include other operations such as cleaning operations, activation...

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Abstract

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

Description

RELATED APPLICATIONS [0001] This Application is a continuation-in-part of U.S. patent application Ser. No. 10 / 434,289 filed on May 7, 2003, and claims benefit of U.S. Provisional Patent Application No. 60 / 533,946 filed on Dec. 31, 2003, U.S. Provisional Patent Application No. 60 / 506,103 filed on Sep. 24, 2003, U.S. Provisional Patent Application No. 60 / 474,625 filed May 29, 2003, and to U.S. Provisional Patent Application No. 60 / 468,741 filed May 7, 2003; and the '289 application in turn claims benefit of U.S. Provisional Patent Application No. 60 / 379,129, filed on May 7, 2002. Each of these applications is hereby incorporated herein by reference as if set forth in full.FIELD OF THE INVENTION [0002] The embodiments of various aspects of the invention relate generally to the formation of three-dimensional structures (e.g. meso-scale or microscale structures) using electrochemical fabrication methods wherein heat treatment is provided to improve interlayer adhesion. BACKGROUND [0003] ...

Claims

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Application Information

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IPC IPC(8): C25D1/00C25D5/02C25D5/10C25D5/12C25D5/14C25D5/18C25D5/34C25D5/40C25D5/48C25D5/50H01L21/288H01L21/768H05K3/24
CPCC25D5/022C25D5/10C25D5/12C25D5/14C25D5/18C25D5/34C25D1/003C25D5/48C25D5/50H01L21/2885H01L21/76879H05K3/241H05K3/243C25D5/40
Inventor ZHANG, GANGCOHEN, ADAM L.LOCKARD, MICHAEL S.KUMAR, ANANDA H.KRUGLICK, EZEKIEL J. J.KIM, KIEUN
Owner UNIV OF SOUTHERN CALIFORNIA
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