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Damp embedding glue of epoxy resin

A technology of epoxy resin and potting glue, which is applied in the field of damping potting glue, can solve the problems of seldom mentioned damping performance, large thermal stress, low expansion, etc., and is suitable for industrial production, excellent damping performance, easy The effect of the operation

Inactive Publication Date: 2007-05-09
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current epoxy resin potting compound only emphasizes its formability, adhesion, moisture resistance, heat resistance, thermal stress characteristics, low expansion and other properties, and rarely mentions its damping performance; although there are a few products but Its performance is poor, if it cannot meet the room temperature curing conditions, the heat released during the curing process will cause large thermal stress, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Weigh each component according to the following ratio of parts by mass and mix them evenly. Curing at room temperature for 48 hours, or curing at room temperature for 2 hours at 80°C and 2 hours at 120°C, and testing its damping performance with a dynamic mechanical analyzer. Tg is 28℃, tanδ max is 0.84, and the temperature range of tanδ>0.3 is 45°C.

[0021] Rigid epoxy CYD-127 100 parts,

[0022] Linear aliphatic flexible epoxy resin RZ-102 150 parts,

[0023] 15 parts of propylene oxide butyl ether (BGE),

[0024] 10 parts of liquid-terminated carboxylated nitrile rubber,

[0025] 35 parts of tetraethylenepentamine.

Embodiment 2

[0027] Weigh each component according to the following ratio of parts by mass and mix them uniformly. Curing at room temperature for 48 hours, or curing at room temperature for 2 hours at 80°C and 2 hours at 120°C, and testing its damping performance with a dynamic mechanical analyzer. Tg is 46°C, tanδ max is 0.95, and the temperature range of tanδ>0.3 is 52°C.

[0028] Rigid epoxy F-51 100 parts,

[0029] Linear aliphatic flexible epoxy resin DER-732 30 parts,

[0030] 25 parts of polypropylene glycol diglycidyl ether,

[0031] 15 parts of liquid-end hydroxynitrile rubber,

[0032] Polyethylene polyamine 28 parts.

Embodiment 3

[0034] Weigh each component according to the ratio in parts by mass and mix them uniformly. Curing at room temperature for 48 hours, or curing at room temperature for 2 hours at 80°C, and testing its damping performance with a dynamic mechanical analyzer. Tg is 69°C, tanδ max is 1.2, and the temperature range of tanδ>0.3 is 75°C.

[0035] Rigid epoxy E-44 100 parts,

[0036] Linear aliphatic flexible epoxy resin RZ-1021 20 parts,

[0037] 10 parts of ethylene glycol diglycidyl ether,

[0038] 40 parts of curing agent polyetheramine,

[0039] Liquid end amino nitrile rubber 20 parts,

[0040] 15 parts of curing agent ethylenediamine.

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PUM

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Abstract

This invention relates to a damping sealant, especially an epoxy resin damping sealant, which is composed of component A and component B (15-100 wt. % of component A). Component A is prepared from: rigid epoxy resin 100 parts, flexible epoxy 5-100 parts, active diluent 5-40 parts, and liquid nitrile butadiene rubber 5-25 parts. Component B is amino curing agent. The glass transition temperature of the epoxy resin damping sealant can be adjusted between -20-120 deg.C according to different requirements. The epoxy resin damping sealant has such advantages as wide damping temperature range, high loss factor (tanmax greater than 0.5), and easy operation.

Description

technical field [0001] The invention belongs to the field of polymer damping materials, and in particular relates to a damping potting glue. Background technique [0002] Potting is the operation process of rationally arranging, assembling, bonding, connecting, isolating and protecting the various components that constitute electronic devices or integrated circuits according to the specified requirements, so as to prevent moisture, dust and harmful gases from affecting electronic devices or integrated circuits. The intrusion of the circuit, the purpose of slowing down the vibration, preventing external force damage and stabilizing the parameters of components. Epoxy resin is a type of packaging material that has developed rapidly in recent years. It is relatively cheap, has a simple molding process, is suitable for mass production, and has high reliability. At present, 80% to 90% of foreign semiconductor devices (almost all in Japan) are encapsulated by epoxy resin, and its...

Claims

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Application Information

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IPC IPC(8): C09K3/10C09J163/00C09J109/02
Inventor 黄志雄石敏先
Owner WUHAN UNIV OF TECH
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