Organic metal compound supplying container

Abstract

This invention provides an organic metal compound supplying vessel for attaining quantity of vaporization of an organic metal compound having a constant reproducibility, and for reducing drop of usage of the organic metal compound as a filler when quantity of vaporization of the organic metal compound by increasing a flow rate of the carrier gas. In the organic metal compound supplying vessel, anend of a carrier gas introducing pipe is provided at the upper part of the vessel, an end part of the carrier gas exhausting pipe is provided at the bottom thereof, and the vessel is filled with a carrier supporting organic metal compound in which the carrier which is inactive to the organic metal compound is covered with the organic metal compound in the solid state under the normal temperature.The end of the carrier gas introducing pipe is specifically arranged with inclination of 20 to 50 degree in the diagonal lower direction for the horizontal direction.

Description

technical field [0001] The present invention relates to organometallic compound supply containers. In particular, it relates to an organometallic compound supply container filled with a carrier-supported organometallic compound obtained by coating a solid organometallic compound on a carrier inert to the organometallic compound at room temperature. Background technique [0002] Organometallic compounds are used in the electronics industry, for example, as raw materials for compound semiconductors. When an organometallic compound is used in the electronics industry, a carrier gas such as hydrogen is usually made to flow in contact with the organometallic compound, and the saturated vapor of the organometallic compound is introduced into a vapor phase growth apparatus or the like for use. [0003] For organometallic compounds that are solid at normal temperature (room temperature), there are disadvantages that even if a carrier gas different from that of liquid is blown in, a...

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Problems solved by technology

[0003] For organometallic compounds that are solid at normal temperature (room temperature), there are disadvantages that even if a carrier gas different from that of liquid is blown in, a flow path through which the carrier gas passes is formed in the laminated solid organometallic compound, or it becomes gasified due to gasification. Small-sized solid organometallic compounds accumulate at the bottom of the container, and as a result, sufficient contact between the solid organometallic compound and the carrier gas cannot be obtained, and a stable concentration of the organometallic compound cannot be supplied to the vapor phase growth device

[0005] However, the supply container described in Japanese Patent Laid-Open No. 1-265511 has the following problems: although the evaporation amount of the organometallic compound with a certain repeatability can be obtained, if the carrier gas flow rate is increased and the organic When the gasification amount of the metal compound is reduced, the usage rate of the filled organometallic compound decreases, that is, at the point when a certain concentration of organometallic compound-containing gas cannot be obtained, the amount of organometallic compound remaining in the supply container increases.

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