Plate type heat exchanger and method of manufacturing the same

Abstract

A method for manufacturing a plate-type heat exchanger in which a heat medium is sealed in a hollow part of an airtight structure formed in the interior of a plate-like container, and the heat medium is moved by capillary force from a condensing part to an evaporating part in the hollow part along heat-medium-guiding grooves formed in the container's inside surface portions that face the hollow part; wherein a plastic workable metal plate of specific thermal conductivity is prepared; a carving tool is used to repeatedly carve out a surface portion of the metal plate at specific intervals along the surface portion, forming a plurality of plate-like fins; and a plurality of grooves formed between these fins is used as heat-medium-guiding grooves. A plate-type heat exchanger is obtained which comprises extremely small heat-medium-guiding grooves that have the necessary capillary force to move the heat medium from the condensing part to the evaporating part without affecting the set alignment or other such characteristics.

Description

technical field [0001] The present invention relates to a flat heat exchanger suitable for use as a flat heat pipe, a vapor chamber, etc. for cooling heat generating bodies such as semiconductor chips and integrated circuit boards, and a method for manufacturing the same. Background technique [0002] In recent years, computer equipment tends to be more and more miniaturized and high-performance. As the performance increases, the heat generated by semiconductor elements and integrated circuits also increases. If an effective cooling method for these components can be provided, further miniaturization and high performance of computer equipment can be promoted. [0003] In order to cool high-output, highly-integrated chips and the like, various cooling systems have been proposed. As such a cooling system, a liquid-cooled heat exchanger typified by a heat pipe has attracted attention. Heat pipes that are liquid-cooled heat exchangers are classified into circular tube-shaped h...

AI Technical Summary

Problems solved by technology

In such a vacuum state, the working fluid sometimes boils, and there is a problem that it is difficult to inject the working fluid

In addition, when the mating surfaces of the body member and the cover member are sealed so that the hollow part forms an airtight structure, there is also the problem that the sealing operation is extremely difficult due to the vacuum state in the vacuum furnace.

[0015] Therefore, insufficient working fluid is caused, the amount of working fluid in the evaporator is insufficient, and the heat-generating parts cannot be cooled sufficiently, so that the temperature of the heat-generating parts rises excessively, which may cause performance degradation or failure of heat-generating parts such as semiconductor elements and integrated circuits. dangerous

In addition, since the sealing of the mating surface of the body member and the cover member is not complete, the vacuum degree of the hollow part is reduced, and the phase change and movement of the working fluid cannot be carried out smoothly, resulting in a reduction in the movement of heat, and there is a problem of cooling as a heat pipe. ability to significantly reduce the risk of such major problems

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