Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Welding alloy for sputtering target production and sputtering target

A technology for welding alloys and sputtering targets, which is applied in the field of sputtering targets and welding alloys for sputtering target manufacturing, can solve the problems of many processes, high costs, and reduced production efficiency, so as to improve production efficiency, prevent strength deterioration, Effect of reducing the amount of Cu corroded

Active Publication Date: 2006-12-20
MITSUI MINING & SMELTING CO LTD
View PDF10 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of method requires a film-forming device, so it has the problems of high cost and many process times, which reduces production efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Welding alloy for sputtering target production and sputtering target
  • Welding alloy for sputtering target production and sputtering target

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～2

[0059] Embodiment 1~2, comparative example 1~6

[0060] Sn-Zn solder alloys with the ratio of Sn / Zn (weight %) = 97 / 3, 91 / 9 were prepared from raw materials Sn (purity 99.99%) and Zn (purity 99.99%) (referred to as sample No. 1, 2).

[0061] As a comparison, Sn-Zn solder alloys (referred to as sample No. ~6).

[0062] In addition, as a comparison, solder alloys with the ratio of In / Sn (weight %) = 100 / 0, 15 / 85 were prepared using raw materials In (purity 99.99%) and Sn (purity 99.99%) (referred to as sample No. 7, 8).

[0063] The (1) melting point, (2) temperature dependence of bonding strength, (3) corrosion amount of support plate (Cu), (4) and Al target of obtained samples No. 1 to 8 were analyzed by the following methods The dissolution property was evaluated. The results are shown in Table 1.

[0064] (1) Determination method of melting point

[0065] The above-mentioned samples No. 1 to 8 were respectively measured on a differential thermal analysis device TG-DTA...

Embodiment 3～17

[0077] Using the sample No.2 (Sn / Zn (weight %)=91 / 9) welding alloy of the above-mentioned embodiment 2, various target materials (Al alloy, Ti, Ti alloy) , Mo, Mo alloy, Ta, Si, Nb, Cu, Cr, Ag, Ag alloy) and 20mm × 20mm × 5mm t Cu support plate, and then use the tensile test device automatic plotter AGS-500B (island Tsu Manufacturing Co., Ltd.), and the bonding strength was measured at room temperature (23° C.). In addition, while measuring the temperature near the joint with a thermocouple, it was heated with a Heating Gun (manufactured by Hakuko Co., Ltd.), and the joint strength at the time of temperature rise (60, 90, 120, and 150°C) was also measured. Determination.

[0078] The results are shown in Table 2.

[0079] In addition, the results of measuring the corrosion amount of each support plate (Cu) by the same method as in Example 2 were almost the same as those in Example 2.

[0080] Table 2

[0081]

[0082] As shown in Table 2, it was shown that the welding a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
bond strengthaaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a jointing alloy of two or more metallic elements for jointing butt and underprops whose raw materials include Cu or alloy of Cu and other metallic elements when making spatter butt. Characterized in that it contains 3 to 9 percent Zn, Sn and sundries that cannot be cleaned.

Description

technical field [0001] The present invention relates to a welding alloy for sputtering target production and a sputtering target produced using the same. In particular, it relates to a welding alloy which is used when bonding a target material and a support plate to manufacture a sputtering target, has high bonding strength even under high temperature conditions, and has very little corrosion to a support plate made of Cu or Cu alloy, and a solder alloy manufactured using the same sputtering target. Background technique [0002] Heretofore, the sputtering method is one of well-known thin film forming methods. [0003] The target used in this sputtering method is continuously impacted by high-energy particles such as ions during sputtering, and heat is accumulated inside it to form a high temperature. For this reason, the target is usually joined to a cooling plate called a support plate made of a material with good thermal conductivity such as Cu or a Cu-based alloy, and t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00B23K35/24C23C14/34
CPCB23K35/262C22C13/00C23C14/3414
Inventor 尾野直纪森中泰三
Owner MITSUI MINING & SMELTING CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com