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A kind of preparation method of double-sided copper foil adhesive-free substrate

A double-sided copper foil and copper foil technology, which is applied in the field of preparation of double-sided adhesive-free substrates, can solve the problems of inorganic compounds losing bending fatigue and folding resistance, and resistivity cannot be met.

Inactive Publication Date: 2011-12-14
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In JP7316422, JP2002235011A open patent, fluorine resin is dispersed in thermoplastic polyimide resin to improve physical properties and reduce the difference in expansion coefficient between copper and thermoplastic polyimide resin (copper foil expansion coefficient 19ppm / °C), but inorganic Compound composition loses bending fatigue and folding resistance
In JP415257, JP2002363284, JP2003119282A, JP2002114848A, JP2002322276A, and JP2002167508A, the use of thermoplastic polyimide resin can only be used for single-sided two-layer substrates, which cannot meet the requirements of 1×10 14 Requirements for Ω·cm resistivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Bottom layer additive compound

[0025] Will weigh 3-(N-SALTCYLOYL) (abbreviated as CDA-1) 10%, 2-aminopropyltriethoxysilane 5%, E-44 epoxy resin 5%, ethanol 80% (described as weight percentage ), stirring and mixing to prepare the bottom layer additive compound.

[0026] (2) Thermosetting pre-main resin

[0027] Put 0.11 moles (32 grams) of benzophenone tetraacid dianhydride into a 500 milliliter three-necked reaction flask, stir and dissolve in 350 milliliters of N-methylpyrrolidone, add 0.1 moles (28 grams) of 3,3-dicarboxydiaminobis Benzene and 1.3-bis(3-aminophenoxy)benzene, 0.006 moles (1.3 grams) of bis(3-aminopropyl)tetramethyldisiloxane are completely dissolved and degassed by filtration, and the measured viscosity is 3000pas, prepared as Thermosetting pre-body resin.

[0028] (3) Thermoplastic prepolymer resin

[0029]Add 0.2 mole (62.04 grams) diphenyl ether tetra-acid dianhydride and 145 milliliters of triethylene glycol dimethyl ether in 500 millili...

Embodiment 2

[0045] (1) Bottom layer additive compound

[0046] Weigh 15% of 3-(N-SALTCYLOYL), 10% of 44-diphenylmethane diisocyanate, 5% of E-44 epoxy resin, and 70% of ethanol (the stated percentage is by weight), and stir and mix to prepare the bottom layer additive compound.

[0047] (2) Thermosetting pre-main resin

[0048] Put 0.11 moles (32 grams) of benzophenone tetraacid dianhydride into a 500 milliliter three-necked reaction flask, stir and dissolve in 350 milliliters of N-methylpyrrolidone, add 0.1 moles (28 grams) of 3,3-dicarboxydiaminobis Benzene and 1.3-bis(3-aminophenoxy)benzene, 0.006 moles (1.3 grams) of bis(3-aminopropyl)tetramethyldisiloxane, filtered and degassed after dissolution completely, measured viscosity is 3000pas, prepared into a thermosetting pre-host resin.

[0049] (3) Thermoplastic prepolymer resin

[0050] Add 0.2 mole (62.04 grams) diphenyl ether tetra-acid dianhydride and 145 milliliters of triethylene glycol dimethyl ether in 500 milliliters of thre...

Embodiment 3

[0066] (1) Bottom layer additive compound

[0067] Weigh 10% of 3-(N-SALTCYLOYL), 5% of 2-aminopropyltriethoxysilane, 15% of epoxy-containing acrylic rubber, and 70% of ethanol (the stated percentage is by weight), and stir and mix to prepare the bottom layer additive compound.

[0068] (2) Thermosetting pre-main resin

[0069] Put 0.11 moles (32 grams) of benzophenone tetraacid dianhydride into a 500 milliliter three-necked reaction flask, stir and dissolve in 350 milliliters of N-methylpyrrolidone, add 0.1 moles (28 grams) of 3,3-dicarboxydiaminobis Benzene and 1.3-bis(3-aminophenoxy)benzene, 0.006 moles (1.3 grams) of bis(3-aminopropyl)tetramethyldisiloxane are completely dissolved and degassed by filtration, and the measured viscosity is 3000pas, prepared as Thermosetting pre-body resin.

[0070] (3) Thermoplastic prepolymer resin

[0071] Add 0.2 mole (62.04 grams) diphenyl ether tetra-acid dianhydride and 145 milliliters of triethylene glycol dimethyl ether in 500 mi...

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PUM

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Abstract

The invention discloses a method for preparing a double-sided copper foil adhesive-free base material, especially for preparing a condensation thermoplastic double-sided copper foil adhesive-free base material, which is prepared by anti-ion migration additive compound on the roughened surface of the copper foil. Treatment and coating, and then through the reaction of thermoplastic prepolymer resin and thermosetting pre-main resin, compound heating, pressurization, and imidization at 300 ° C for 30 minutes to obtain ultra-thin double-sided copper insulating layer Double-sided copper foil adhesive-free substrate. The method of the invention has simple process and low cost, and the volume resistivity of the prepared insulating layer is 1×1014Ω·cm, which can meet the requirements of multilayer flexible circuit board products.

Description

Technical field: [0001] The invention relates to a preparation method of a multilayer flexible ultra-fine circuit wiring product, in particular to a preparation method of a double-sided adhesive-free substrate with rolled copper foil on both sides and a thermoplastic polyimide insulating layer in the middle. Background technique: [0002] With the emergence of multi-layer flexible circuit products, the requirements for the use of double-sided adhesive-free substrates for multi-layer flexible circuits are getting higher and higher, and the wiring width is below 30 μm to form integrated multi-layer and halogen-free. 1000 hours, high humidity 90% 1000 hours without change, demanding, narrow environment, small space, light weight, forming up and down three-dimensional wiring, has the characteristics of being able to be formed at any position or on any shape of the surface, and can realize the smallest The conductive area reaches the maximum conductive performance, so that high-d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/14B32B37/06C08G73/10C08K5/541
Inventor 刘萍王平
Owner SHENZHEN DANBOND TECH
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