Minitype thermoacoustic refrigerator module device

A thermo-acoustic refrigeration and micro technology, applied in refrigerators, refrigeration and liquefaction, gas cycle refrigerators, etc., to achieve high refrigeration efficiency, simple structure, and cost reduction.

Inactive Publication Date: 2006-09-06
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0029] The technical problem to be solved by the present invention is: for the diversity of actual electronic chips and optoelectronic chips, as well as the diversity of cooling purposes and temperature requirements, only modular refrigeration devices can be used to realize the independent control of each chip refrigerat

Method used

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  • Minitype thermoacoustic refrigerator module device
  • Minitype thermoacoustic refrigerator module device
  • Minitype thermoacoustic refrigerator module device

Examples

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specific Embodiment 1

[0045] see figure 2 , a schematic diagram of the first structural scheme of the micro-thermoacoustic refrigeration module of the present invention, the refrigeration module is an acoustic refrigeration module driven by a micro-coil array membrane. The outer dimension of the present invention is 4.8×8×16mm, the total thickness direction is 4.8mm, and the effective thickness of the module is 4mm. The front end drives the film coil 1, the front permanent magnet film 2, the hot end heat exchanger 3, the hot end heat exchanger extension surface 4, the cold end heat exchanger 5, the regenerator 6, the skeleton 7, and the cold end heat exchanger extension Surface 8, back-end film coil 9, back-end permanent magnet film 10, hot-end heat exchanger 11, heat-insulating film 12 and other parts and suitable resonant cavities.

[0046] figure 2 Two sets of regenerators 6, corresponding cold-end heat exchangers 5 and hot-end heat exchangers 3 are arranged in the center. There are two laye...

specific Embodiment 2

[0048] see image 3 , the second structural scheme of the miniature thermoacoustic refrigeration module composed of planar membrane arrangement of the present invention. The outer dimension of the refrigeration module of the present invention is 4.8×8×16mm, the total thickness direction is 4.8mm, and the effective thickness of the module is 4mm. Including front-end driving membrane assembly 1, rear-end membrane (planar coil) 3, cold-end permanent magnet material membrane 4, skeleton 5, cold-end heat exchanger 6, regenerator 7, hot-end heat exchanger extension surface 8, hot-end Heat exchanger 9, cold-end heat exchanger expansion surface 10 and other parts are formed, certainly also have annexes such as auxiliary insulation film. image 3 The 2 in represents the waveform line, that is, the acoustic waveform line when the thermoacoustic refrigeration module is working.

[0049] The overall dimensions of the micro-thermoacoustic refrigeration module of the present invention are...

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Abstract

The present invention relates to a miniature thermo - acoustic refrigerating module device utilizing thermo-acoustical effect acoustical effect to proceed heat radiation or refrigerating to electronic optoelectronic device optoelectronic device and chip. It contains front drove membrane coil, front end permanent magnetism membrane, hot end heat exchanger, hot end heat exchanger extended surface, cold end heat exchanger, thermal regenerator, frame (resonant cavity resonant cavity), cold end heat exchanger extended surface, rear end membrane coil, rear end permanent magnetism membrane, hot end heat exchanger, diathermic membrane etc. Individual module refrigerating capacity is greater than 200 mw, refrigerating temperature difference being 30 degree centigrade. The present invention fully utilizes thermo-acoustic heat engine advantage to realize cooling chip, eliminating chip hotspot, and chip reliable operation.

Description

technical field [0001] The invention relates to a miniature thermoacoustic cooling module device, in particular to a miniature thermoacoustic cooling module device which uses thermoacoustic effect to dissipate heat or cool down electronic optoelectronic devices and chips. Background technique [0002] With the in-depth study of "high temperature" superconducting materials and high integrated circuit information technology, how to uniformly dissipate heat and eliminate hot spots in electronic and optoelectronic chips has become one of the key directions of new product research in electronic technology. It also puts forward an urgent demand for the miniaturization of refrigeration technology, which provides a good opportunity for the development of micro refrigeration technology. [0003] Micro-thermoacoustic refrigeration technology is a completely new type of refrigeration technology developed in response to the above requirements. Micro-thermoacoustic refrigeration is a re...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/36F25B9/14
CPCF25B2309/1404F25B9/145F25B2309/1415H01L2924/0002
Inventor 刘益才郭方中
Owner CENT SOUTH UNIV
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