Hole-forming method and device based on laser shock wave technology

Abstract

The invention relates to a hole molding method based on laser impact wave technique and relative device. Plating energy-adsorption layers and transparent restrain layers on the positions that needing holes, while the areas of them are larger than the processing hole; according to the shape and size of processing hole, preparing concave, and arranging the work-piece on the concave mold to make the centers of energy-adsorption layer, transparent restrain layer, the processed hole and concave mold matched; arranging the concave mold on the multiple-axle linkage workbench; according to the size of hole, setting the light spot size and the energy of laser impulse; the laser beam via the light guide tube, reflective glass, light spot adjuster, focusing device and transparent restrain layer is emitted on the energy-adsorption layer to induce the laser impact wave, which can compress the work-piece, to complete the punch. The invention has the advantages that: larger processing radius, and lower processing cost.

Description

technical field [0001] The present invention mainly relates to the field of laser processing, in particular to a method and device for rapid forming of holes based on laser shock wave technology, and is especially suitable for round holes, square holes, triangular holes and other holes formed on metal plates with a thickness of less than 2.5mm. Regular shaped holes. Background technique [0002] Metal sheet processing has occupied a very important position in the entire national economy, and is widely used in aerospace, shipbuilding, automobile coverings, home appliances and other production industries. Due to the needs of the structure, there are often many round holes and irregular shapes on the metal sheet The common processing methods mainly include drilling, die punching, laser drilling and laser cutting hole forming. [0003] Drilling is currently a widely used forming method for medium and thick plates. However, due to the extremely low rigidity of thin plates, high ...

AI Technical Summary

Problems solved by technology

The most commonly used cutting tool is CO 2 Although the laser has the advantages of high efficiency and convenient operation, it has the following disadvantages: there are periodic ripples on the incision section, which seriously affects the surface quality of the orifice; due to thermal effects, there are often microcracks on the surface of the plate, and dross appears below the incision phenomenon; due to the auxiliary gas used, the molten material splashes, and the production environment is poor, which cannot meet the processing of high-cleanliness parts; the range of material processing is limited to a certain extent, and the processing of some materials such as copper and aluminum alloys becomes Difficult to obtain, and may even damage the external optics of the laser system

[0007] The technology closest to the technology of the present invention is explosive punching. Explosive forming mainly uses the instantaneous high temperature and high pressure shock wave punching produced when explosives explode, but the process parameters of explosive punching are difficult to control, and the shock wave action time is as long as several years. Milliseconds, the diffusion effect is large, the shape of the hole cannot be precisely formed, and the safety is poor, so it is not used

Images