Technique for plating alnico in copper plate type of crystallizer of conticaster

Abstract

This invention provides a continuous caster copperplate slot electroplating of nickel-cobalt alloys, with the main characteristic of a slot electroplating facility. In this technique, amino-sulfonate system is adopted as electroplating fluid and nickel is adopted as anode. Nickel ion is supplemented in an anode dissolution manner, and cobalt ion is supplemented in a cobalt amino-sulfonate continuous addition manner. The current density is 0.5~25A / sq dm, the temperature is 45~60 deg.C and the pH value is 4.0~5.5. Compared to current technologies, this invention has the advantages of large universality of the facility, wide application, high efficiency, low internal stress of coatings and high toughness. It furthest reduces the generation of thermal cracks and allows a current density of as high as 25A / sq dm. Besides, the cobalt content can be variated at different sites and thickness of the copperplate in a range of 5~80% according to the requirements.

Description

technical field [0001] The invention belongs to the technical field of metal surface treatment, and in particular relates to a sulfamate nickel-cobalt alloy electroplating process for a copper plate of a continuous casting machine crystallizer. Background technique [0002] In the prior art, there are roughly three forms of electroplating on the copper plate surface of the continuous casting machine mold, and there are the following deficiencies: [0003] 1. The electroplating layer of the copper plate adopts the nickel-iron alloy layer. The electroplating system of this process is prone to oxidation of divalent iron, the process stability is poor, the internal stress of the coating is large, and thermal cracks are easy to occur; [0004] 2. Nickel-cobalt alloy is electroplated with a sulfate system. The upper limit of the current density of the sulfate system is small, the production efficiency is low, and the internal stress of the coating is relatively large. [0005] 3....

AI Technical Summary

Problems solved by technology

[0003] 1. The electroplating layer of the copper plate adopts the nickel-iron alloy layer. The electroplating system of this process is prone to oxidation of divalent iron, the process stability is poor, the internal stress of the coating is large, and thermal cracks are easy to occur;

[0004] 2. Nickel-cobalt alloys are electroplated with a sulfate system. The upper limit of the current density of the sulfate system is small, the production efficiency is low, and the internal stress of the coating is relatively large.

[0005] 3. The crystallizer copper plate electroplating equipment adopts a combined type, and the application area is small, which is not suitable for some mold copper plates