Thermal interface material

Abstract

The thermal interface material includes gap filling fluid and metal particle dispersed in the fluid and capable of reacting with air. The particle capable of reacting with air is nanometer level particle. Inside the thermal interface material, the metal particle reacts with air in the interval of the heat source and heat dissipating assembly to reduce or even eliminate interval to lower heat resistance and raise heat conducting performance. The reaction product with high heat conducting performance may further improve the heat conducting performance of the thermal interface material.

Description

【Technical field】 [0001] The invention relates to a thermal interface material. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher. However, the volume of devices has become smaller and smaller, and their demand for heat dissipation has become higher and higher. more important question. To meet this requirement, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation are widely used, and certain heat dissipation effects have been achieved. [0003] see figure 1 , due to the inevitable surface roughness of the radiator 20 and the heating element 30 (heat sources such as semiconductor integrated devices, such as CPU), the gap 50 formed between the radiator 20 and the heating element 30 makes the radiator 20 and the heating element 30 General...

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Problems solved by technology

[0005] In order to solve the problem in the prior art that the thermal interface material cannot fully fill the gap between the radiator and the heating element, resulting in poor thermal conductivity, the main purpose of the present invention is to provide a fully gap-filling and Thermal interface material with excellent thermal conductivity

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