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Flip chip die bond pads, die bond pad placement and routing optimization

A bonding pad, flip-chip technology, used in electrical components, electrical solid devices, circuits, etc.

Inactive Publication Date: 2005-10-26
THOMSON LICENSING SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, with the current pad layout protocol, the PCB requires a large number of layers

Method used

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  • Flip chip die bond pads, die bond pad placement and routing optimization
  • Flip chip die bond pads, die bond pad placement and routing optimization
  • Flip chip die bond pads, die bond pad placement and routing optimization

Examples

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Embodiment Construction

[0025] In accordance with one aspect of the present invention, a system, apparatus, and / or method is presented that provides an integrated circuit (IC) die bonding layout that allows for a minimum number of layers of a mating printed circuit board (PCB). The IC die bonding can be used for flip-chip, such as flip-chip ball grid array (BGA) applications.

[0026] In one form thereof, this aspect takes into account the routing capabilities of the PCB and spaces every other row of bonding pads such that bonding pads from every other row and in relation to Two wires are routed between the outer row of bonding pads. This provides staggered spacing for the bond pads. At the same time, according to the principle of the present invention, there are many ways to realize the staggered spacing of the bonding pads, image 3 , 4 Several approaches and their corresponding pitches are shown in and 5.

[0027] When routing between pads on the same layer of the mating PCB is employed, pitch ...

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PUM

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Abstract

An integrated circuit die for a flip chip has circular die bond pads. Circular die bond pads allows for a higher density of bond pads when a mating printed circuit board has routing lines between its corresponding pads. In one form, there is provided a flip chip having a die and a plurality of die bond pads situated on the die. Each die bond pad of the die is circular.

Description

[0001] This U.S. provisional patent application claims the benefit and / or priority of an earlier application: U.S. Provisional No. 60 / 354,070, filed January 31, 2002, entitled "Circular Die Bond Pads For Routing Optimization on a Mating Printed Circuit Board" Patent applications; U.S. Provisional Patent Application No. 60 / 354,069, filed January 31, 2002, entitled "Die Bond Pad Placement Optimization For Minimal BGAPCB Layers"; and filed January 31, 2002, entitled "Die Size Minimization US Provisional Patent Application No. 60 / 353,804 by Using Flip-Chip Bond Pad Placement and PCB Routing For Power and Ground". technical field [0002] The present invention relates to flip chips, and more particularly to die bond pads, die bond pad layout and / or routing optimization for flip chips. Background technique [0003] Flip-chip technology requires a multilayer printed circuit board (PCB) to support the routing of bond pads on the IC die to external solder ball pads on other integrate...

Claims

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Application Information

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IPC IPC(8): H01L23/48
CPCH01L2924/0002H01L2924/14
Inventor 埃里克·S·卡尔斯加德
Owner THOMSON LICENSING SA
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