Ultrasonic elliptically vibrating boring process

Abstract

The ultrasonic elliptically vibrating boring process in the field of precise machining technology includes the following steps: 1) adhering two piezoelectric ceramic chips onto two orthogonal surfaces of elliptically vibrating amplitude-varying rod; 2) applying sinusoidal voltage across the chips to make the chips to stretch and contract and the rod to bend and vibrate; 3) strengthening the bending and vibration of the rod; 4) making the boring cutter fixed to the tip of the rod obtain maximum elliptic vibration; 5) synthesizing the horizontal and vertical bending vibrations to obtain the elliptic vibration track in the edge of the boring cutter; and 6) fixing the elliptically vibrating amplitude-varying rod onto the boring rod via the vibration node. The present invention has greatly reduced boring force, reduced boring rod deformation, raised stability of the boring system and raised boring precision and surface smoothness.

Description

technical field [0001] The invention relates to a boring processing method belonging to the technical field of mechanical processing, in particular to an ultrasonic elliptical vibration boring processing method. Background technique [0002] With the development of aerospace and optics, there are a large number of thin-walled deep-hole parts in the field of aerospace and optical equipment that require precision boring. , It is easy to cause chatter, which makes the boring surface quality, boring dimensional accuracy and shape accuracy drop sharply. The accuracy and quality of processing thin-walled deep holes by grinding methods cannot meet the ideal processing requirements. The reason is that the cantilever of the grinding wheel shaft used for grinding is long, which is easy to cause chatter. At the same time, the grinding temperature causes zero thermal deformation of thin-walled deep holes, resulting in grinding. The quality of the cut surface is deteriorated, the dimens...

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Problems solved by technology

[0002] With the development of aerospace and optics, there are a large number of thin-walled deep-hole parts in the field of aerospace and optical equipment that require precision boring. , it is easy to cause chatter, so that the boring surface quality, boring dimensional accuracy and shape accuracy drop sharply

The accuracy and quality of processing thin-walled deep holes by grinding methods cannot meet the ideal processing requirements. The reason is that the cantilever of the grinding wheel shaft used for grinding is long, which is easy to cause chatter. At the same time, the grinding temperature causes zero thermal deformation of thin-walled deep holes, resulting in grinding. The quality of the cut surface is deteriorated, the dimensional accuracy and shape accuracy are poor, and it is difficult to meet the actual needs of production

[0003] After searching the prior art documents, it was found that Gao Yinhan and others wrote an article "Research on "Stiffening" of Ultrasonic Vibration Boring" in the first issue of "Journal of Mechanical Engineering" in 1996. The method is to add ultrasonic linear vibration to the A boring method on a boring tool. This paper analyzes the effect of "rigidity" of the ultrasonic linear vibration boring method. The analysis results show that: compared with ordinary boring, ultrasonic linear vibration boring can reduce the boring force and The deformation of the boring bar and the improvement of machining accuracy, etc., but to further reduce the boring force and improve the machining accuracy, ultrasonic linear vibration boring, that is, the ordinary ultrasonic vibration boring method, is difficult to meet this high requirement

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