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Method for controlling additive distribution uniformity of silver-tin anhydride electride contact material

A technology of electrical contact material and distribution uniformity, applied in the direction of contact material, metal material coating process, liquid chemical plating, etc., can solve the problems of improving the wettability and separation of tin oxide and silver, etc. Achieve good mechanical and physical properties, improve uniformity, and good wettability

Inactive Publication Date: 2005-07-20
LINGRI SURFACE ENG NINGBO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can partially improve the distribution of added elements, it is prone to the separation of copper or bismuth hydroxide and tin oxide, and cannot improve the wettability of tin oxide and silver.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Weigh 300 grams of tin oxide powder, conduct sensitization treatment in 3%-5% stannous chloride solution for 15 minutes, then activate treatment in 0.3%-0.5% palladium chloride solution for 15-30 minutes, and wash the powder Crushed after drying. The pretreated tin oxide powder is added to the electroless copper plating solution of the following composition for electroless copper plating: 20g / L copper sulfate, 30g / L disodium edetate, 20mg / L potassium ferrocyanide, 15g / L L sodium hydroxide, 10g / L formaldehyde, 80g / L methanol, the balance is water; the pH value of the plating solution is 13.5, the temperature is 55°C, and the plating is carried out under ultrasonic waves with a frequency of 40KHz; Oxidation treatment in air at 300°C for 1 hour; the treated powder was mixed with 12 grams of Bi 2 o 3 , 4 grams of WO 3 Mix and carry out electroless silver plating in the following solution under ultrasonic waves: 17.5g / L silver nitrate, 6g / L formaldehyde, 35g / L ammonia wat...

Embodiment 2

[0039] Take by weighing 360 grams of tin oxide powder and carry out electroless copper plating, and the sensitization and activation treatment are the same as in Example 1. The electroless copper plating solution is composed of: 30g / L copper sulfate, 45g / L disodium edetate, 20mg / L potassium ferrocyanide, 23g / L sodium hydroxide, 15g / L formaldehyde, 120g / L methanol, The balance is water; the pH value of the plating solution is 13.0, the temperature is 45°C, and the plating is carried out under ultrasonic waves with a frequency of 40KHz; after copper plating, the tin oxide powder is oxidized in air at 300°C for 1 hour. Treated powder with 15 g Bi 2 o 3 , 5 g MoO 3Mix and carry out electroless silver plating in the following solution under ultrasonic waves: 17.5g / L silver nitrate, 6g / L formaldehyde, 35g / L ammonia water, 2g / L sodium hydroxide, and the balance is water; Ultrasound with a frequency of 40KHz is performed. The sintering temperature was selected at 920° C. for 1 hou...

Embodiment 3

[0041] Weigh 300 grams of tin oxide powder and carry out electroless copper plating, and the sensitization and activation treatment are the same as in Example 1. The electroless copper plating solution consists of: 50g / L copper sulfate, 60g / L disodium edetate, 40mg / L potassium ferrocyanide, 30g / L sodium hydroxide, 25g / L formaldehyde, 200g / L methanol, The balance is water; the pH value of the plating solution is 12.0, the temperature is 35°C, and the plating is carried out under ultrasonic waves with a frequency of 20KHz; after copper plating, the powdered tin oxide powder is oxidized in the air at 300°C for 1 hour; the treated powder and 12 g Sb 2 o 3 , 4 grams of WO 3 Mix and carry out electroless silver plating in the following solution under ultrasonic waves: 175g / L silver nitrate, 60g / L formaldehyde, 350g / L ammonia water, 20g / L sodium hydroxide, and the balance is water; the temperature is 15°C, and the plating frequency is Carry out under the ultrasonic wave of 20KHz; ...

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Abstract

The invention discloses a method to control the distributing homogeneity of silver- stannic oxide electric contact material additive. Before chemical silvering, taking chemical coppering to the SnO2 powder, takes oxide treatment; taking chemical silvering under ultrasonic joint together with additive. By using the invention, the distribution homogeneity of silver-stannic oxide material would be controlled, and the stannic oxide and silver basal body has good wetting property. The electric contact made following the inventioin has good sintering activity and machine shaping. It can be used to manufacture thread material and plural shapes of contacts.

Description

technical field [0001] The present invention relates to a method of controlling the uniformity of distribution of silver-tin oxide electrical contact material additives. Background technique [0002] Electrical contacts are important parts for switching tasks, and are widely used in home appliances, telecommunication systems and home appliance control machinery. In low-voltage electrical appliances, AgCdO electrical contact material is widely used at present, and the material has excellent comprehensive properties. However, due to the use of toxic cadmium, it will inevitably produce cadmium toxicity during use; at the same time, with the development of low-voltage electrical appliances in the direction of miniaturization, high reliability, and long life, AgCdO contact materials also expose anti-welding properties Poor, serious arc erosion and other shortcomings. Silver-tin oxide contact material is a non-toxic material developed in recent years. It has good welding resista...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/31H01H1/02
Inventor 凌国平刘远廷
Owner LINGRI SURFACE ENG NINGBO
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