Measuring structure and method for micro-electronic mechanical system multi-layer membrane stress and yang's modulus

Abstract

The present invention is multiple-layer film stress and Young's modulus measuring structure and method for microelectronic mechanical system. The measurement structure has superposed n layers of measured film material in equal length a unequal width with fixed two ends to constitute the multiple-layer beam, reinforcing anchor areas on two ends, branched edges on two sides of each anchor area with hole in between, one insulator under the beam and electrodes under the insulator. The measurement method includes: preparing the beam structure, applying voltage across the lower electrodes, increasing the voltage until reaching the critical voltage and recording the sucking voltage, and substituting k measured sucking voltage values into the calculation model of stress and Young's modulus to obtain the stress and Young's modulus of the multiple-layer film.

Description

technical field [0001] The invention relates to a test method capable of online measuring the stress and Young's modulus of a micro-electro-mechanical system (MEMS) multilayer film, and belongs to the technical field of MEMS material parameter measurement. Background technique [0002] With the development of MEMS processing technology, surface micromachining technology has been more and more used in the manufacturing process of sensors and actuators. Many materials, especially crystal materials, are made into the same form by different methods when forming structures such as thin films and thin beams, and their properties are also different, which will show obviously different mechanical parameters. In MEMS devices, the stress of the film is related to that of Yang Young's modulus has a great influence on the performance of the device, and the control of thin film material parameters (eg, stress, Young's modulus) becomes particularly important...

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Problems solved by technology

[0003] In actual MEMS devices, multi-layer film structures are used in many cases. At present, various stress and Young's modulus test structures designed at home and abroad are mostly aimed at single-layer film structures. For multi-layer film structures, it is difficult to measure each layer of film at the same time. The stress and Young's modulus, or the test structure and processing technology are relatively complicated, which is not suitable for online testing

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