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Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work

A composition and electromagnetic wave technology, applied in chemical instruments and methods, magnetic materials, iron compounds, etc., can solve problems such as unsuitable heat dissipation products, low thermal conductivity, etc.

Inactive Publication Date: 2004-09-08
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, they have low thermal conductivity and are therefore less suitable as heat dissipation products

Method used

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  • Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work
  • Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work
  • Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0058] The acrylic-based electromagnetic wave absorbing and thermally conductive composition consisting mainly of a mixture of acrylic resin and electromagnetic wave absorbing filler and having a softening point of at least 40° C. is molded into a heat-softening electromagnetic wave absorbing heat dissipation sheet as described below.

[0059] In all cases, acrylic resin was used as the resin component of the acrylic-based electromagnetic wave absorbing heat-conducting composition and paraffin was used as the heat-softening component. Another ingredient included in the composition is a carbon functional silane used as a surface treatment agent for electromagnetic wave absorbing fillers and thermally conductive fillers. The starting materials used to formulate the compositions are listed below.

[0060] Starting materials

[0061] 1) Paraffin: Paraffin 115 (melting point, 47°C) and Paraffin 130 (melting point, 55°C), manufactured by Nippon Seiro Co., Ltd.

[0062] 2) Acryli...

Embodiment 5-8

[0091] A fluorocarbon resin-based electromagnetic wave absorbing heat conducting composition consisting mainly of a mixture of a fluorocarbon resin and an electromagnetic wave absorbing filler and having a softening point of at least 40° C. is molded into a heat softening electromagnetic wave absorbing heat dissipation sheet as follows.

[0092] In all cases, liquid fluorocarbon resin was used as the resin component of the fluorocarbon resin-based electromagnetic wave absorbing heat-conducting composition and polyvinylidene fluoride / hexafluoropropylene / tetrafluoroethylene ternary resin was used as the heat-softening component. Another ingredient included in the composition is a carbon functional silane used as a surface treatment agent for electromagnetic wave absorbing fillers and thermally conductive fillers. The starting materials used to formulate the compositions are listed below.

[0093] Starting materials

[0094] 1) Kynar 9301 (thermal softening temperature, 80°C),...

Embodiment 9-18 and comparative example 1

[0105] A silicone-based electromagnetic wave absorbing heat conducting composition consisting mainly of a mixture of a silicone resin and an electromagnetic wave absorbing filler and having a softening point of at least 40° C. is molded into a heat softening electromagnetic wave absorbing heat dissipation sheet as described below.

[0106] In all cases, the methylphenylsiloxane resin (by combining the structural unit CH 3 SiO 3 / 2 , (CH 3 ) 2 SiO,C 6 h 5 SiO 3 / 2 , (C 6 h 5 )(CH 3 ) SiO and (C 6 h 5 )2 A copolymer obtained from SiO) is used as a heat-softening component in a silicone-based electromagnetic wave absorbing heat-conducting composition. Two vinyl-group-carrying dimethylpolysiloxanes with different viscosities were used as matrix components. The composition also includes a silicon atom-bonded alkoxy group-containing organopolysiloxane having the following general formula (1) as a surface treatment agent for the electromagnetic wave absorbing filler and the ...

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Abstract

An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Description

technical field [0001] The present invention relates to an electromagnetic wave absorbing and thermally conductive composition for forming electromagnetic wave absorbing and heat dissipating articles, wherein the article is placed on exothermic electronic components and heat dissipating elements that generate heat when operated, obtain a temperature higher than room temperature, and become electromagnetic wave generating sources Such as between the radiator and the circuit board to cool electronic components through heat conduction and absorb electromagnetic waves. The present invention also relates to heat-softening electromagnetic wave absorbing heat-dissipating sheets made of these compositions, and a method of mounting these compositions for heat dissipation purposes. Background technique [0002] Circuit designs for the latest electronic equipment including TVs, radios, computers, medical equipment, office equipment and telecommunications equipment are becoming increasi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01G49/00C08L33/00H01F1/00H01L23/06H01L23/373H05K7/20H05K9/00
CPCH05K9/0083H05K9/00
Inventor 藤木弘直都丸一彦樱井郁男铃木章央美田邦彦
Owner SHIN ETSU CHEM CO LTD
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