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Resin size used for chip resistor

A resin paste and resistor technology, applied in the direction of resistor shell/packaging shell/potting, filling paste, epoxy resin glue, etc., can solve problems such as resistance value drift

Inactive Publication Date: 2004-07-14
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the problem that the paste with glass body as the bonding phase in the prior art will cause large resistance value drift in the process of making chip resistors, the present invention provides a resin paste that can be cured at low temperature

Method used

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  • Resin size used for chip resistor

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Embodiment Construction

[0016] Now in conjunction with table 2 and table 3 illustrate the most preferred embodiment of the present invention, in table 2, the thermosetting or thermoplastic resin that embodiment 1,2,7,8,13,14 adopts is polyvinyl butyral resin, black Fillers are pigmented carbon black and Al 2 o 3 It is prepared by mixing at a weight ratio of 1:4, and the white filler is TiO 2 and CaCO 3 Prepared by mixing at a weight ratio of 1:2; the thermosetting or thermoplastic resins used in Examples 3, 4, 9, 10, 15, and 16 are silicone resins, and the black filler is pigment carbon black and SiO 2 It is prepared by mixing at a weight ratio of 1:4, and the white filler is TiO 2 and Al 2 o 3 It is prepared by mixing in a weight ratio of 1: 2; the thermosetting or thermoplastic resin used in embodiments 5, 11, and 17 is an amino resin, and the black filler is prepared by mixing pigment carbon black and talcum powder in a weight ratio of 1: 4, The white filler is TiO 2 and SiO 2 Prepared by ...

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Abstract

This invention relates to resin sizing material used in sheet resistors including an adhesive and a filler, among which, the adhesive is a mixture of bakelite and epoxy resin formed in an organic solution, the filler is one of white, black fillers or a noble metal powder. The said sizing material is used in a secondary enveloper, markers and end electrodes of the resistor and completely solidified under 160-250deg.C not influencing the sheet resistors.

Description

technical field [0001] The invention relates to a resin slurry, more specifically, the invention relates to a low-temperature curing resin slurry for chip resistors. Background technique [0002] With the technological improvement of IT, 3C (communication, consumer, computer) and other industries, the precision requirements for chip resistors are getting higher and higher. In the prior art, the slurry of the secondary encapsulation body and the marker body and the slurry of the terminal electrode all use glass as the bonding phase (called glass paste), wherein the secondary encapsulation body and the marker body The paste composition includes inorganic pigment, glass frit and organic vehicle; the paste composition of terminal electrode includes silver powder or other metal powder, glass frit and organic vehicle. In order to increase adhesion and improve processability, the above-mentioned glass frits usually must contain lead. When preparing these slurries, the components ...

Claims

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Application Information

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IPC IPC(8): C09D5/34C09J163/00C09K3/10H01C1/02
Inventor 金福臻孟淑媛郭铁成孔庆松刘静洲
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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