High radiation miniature package for semiconductor chip

Abstract

A high radiation micropackaged device of a semiconductor chip includes a wire frame and a base board, among which, a concave platform chip seat is set at the center of the frame with engraved slottedeyes surrounding it, only several supporting plates connecting the seat to the frame, high density circuit and multiple pads and tin balls, a chip joining to the top of the seat of the frame with a binding agent, combining the chip pads and the base board pads with metal wires and filling glue into the engraved slotted eyes, wrapping the metal wires and part surfaces of the frame.

Description

【Technical field】 [0001] The invention relates to a packaging body of a semiconductor chip, in particular to a micro packaging body of a semiconductor chip with high heat dissipation. 【Background technique】 [0002] Generally speaking, in the known three-dimensional packaging technology of semiconductor chips, common figure 1 The structure shown is generally applied to TEBGA, IIQFP, etc., and its main structural feature is to bond a chip 2' with a bonding agent 23' on a substrate 1', and then bond it to the foot pad 21 of the chip 2' by wire bonding technology. The chip 2' and the substrate 1' are bonded to each other with gold wires 22', and the chip 2' and its gold wires 22' are covered with a cooling plate 3', and then encapsulated with a sealant 5' around the cooling plate 3'. Since this method must add a heat sink 3' outside the chip 2', it cannot achieve the goal of being small and thin. [0003] Another idiom such as figure 2 As shown, it is generally used in EBGA...

AI Technical Summary

Problems solved by technology

However, in this method, since the chip 2' must be placed below the entire package, the size of the chip and the location of the bonding wire must be considered when designing the solder ball 12' on the surface of the substrate 1', so that the entire package cannot be effectively reduced. volume of

Images