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Working device and working method, and production equipment using it

A processing device and processing method technology, applied in the direction of metal processing equipment, electric heating devices, welding equipment, etc., can solve the problems of inability to perform high-speed solder joints, solder balls or solder scattering, etc.

Inactive Publication Date: 2004-03-03
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the case of using a laser light source to weld weakly heat-resistant parts, when high-output heat energy is supplied in a short time, problems such as solder balls or solder scattering may easily occur
[0007] Therefore, when the workpiece is moved to each joining point with a servo motor, etc., it takes time to move light sources such as light bulbs and lasers, so high-speed welding and joining cannot be performed.

Method used

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  • Working device and working method, and production equipment using it
  • Working device and working method, and production equipment using it
  • Working device and working method, and production equipment using it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0047] FIG. 1 is an overall configuration diagram of a processing apparatus in the first embodiment. The workpiece 13 is composed of a printed circuit board coated with cream solder as a bonding agent, and a surface mount component fixed to the substrate. In order to solder and join printed substrates and surface mount components, the device includes: a light energy power supply 101 and a laser diode device 1 that irradiate light energy to melt solder, and an optical system 2 that guides light energy to the joint position as an optical means for irradiating spot light , the current control device 4 and the current mirror 3 for scanning the spot light at a high speed on the part to be fused, and the table 5 a on which the workpiece 13 is placed. The apparatus also includes a heating device 5b for preheating the workpiece 13 on the table 5a as means for improving the processing quality and performance.

[0048] The workpiece 13 is placed on the table 5a and heated by a heating ...

Embodiment approach 2

[0054] After the control device 8 of Fig. 1 reads out the processing condition corresponding to the processing position of the processed object 13 from the processing condition memory 104, it supplies the light energy power supply 101, and the power supply 101 controls the laser diode device 1 to make it generate specified energy, so that by The light converged by the optical system 2 is reflected by the galvano mirror 3 and then irradiates the workpiece 13 . At the same time, by supplying the heating position information from the heating position memory 105 to the current control device 4, the current mirror can guide the incident light to the heating position. In addition, the heating device 5 b preheats the workpiece 13 based on information from the processing condition memory 104 .

[0055] A personal computer, a programmer, etc. are used as processing conditions 104, 105.

Embodiment approach 3

[0057] After the control device 8 in FIG. 2 reads out the corresponding current processing conditions from the processing condition memory 104 , it supplies the light energy power source 101 to process the workpiece 13 . At the same time, the processing state is read in by the camera 9, and the processing result is recognized by the image recognition device 10. The comparison means 102 compares the normal processing information stored in the processing state memory 103 with the recognized processing results, and then feeds back to the processing condition memory 104, and supplies the processing conditions corrected according to the feedback information to the optical power source 101 for welding and bonding.

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Abstract

A machining apparatus includes a light source (1) for generating light energy, an optical system (2, 3) for guiding the generated light energy to a joint position of a workpiece, a table (5a) on which the workpiece is mounted, and a heating device (5b) provided at the table for heating the workpiece. The machining apparatus, a machining method and production equipment using the machining apparatus allow the workpiece to be locally heated fast, which is applicable to soldering or the like.

Description

technical field [0001] The invention relates to a processing device and a processing method using thermal energy and the equipment produced therewith. Background technique [0002] In conventional processing equipment, after the workpiece is placed in a heating furnace (hereinafter referred to as reflow furnace) heated to a necessary temperature, the joints of the workpiece are assembled and welded (hereinafter referred to as reflow). Or use the heat generated by light bulbs or laser light sources for solder joints. [0003] When putting parts with different heat-resistant properties, special-shaped parts, and parts with different colors to be processed into the reflow furnace for reflow, because the weak heat-resistant parts are burned, damaged or deformed, such parts cannot be processed. The processed object is put into the remelting furnace for remelting. [0004] In addition, for a workpiece whose initial temperature rise time and temperature are to be changed in the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/21B23K1/00B23K1/005B23K3/04B23K31/02B23K101/42H05K3/34
CPCB23K1/005H05K3/3494B23K1/0056
Inventor 远藤正佐藤正博藤井孝治长安同庆渡辺镇后藤康宏石野久秀小谷贤志栗秋博幸清水隆
Owner PANASONIC CORP
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