Light waveguide and optical fiber coupling method and device for lithium niobate modulator

Abstract

The coupling device of the present invention includes two pieces of proper fiber, fiber fixing block and fiber reinforcing block; spacer combination; LN waveguide chip; and package shell. The fiber with fiber fixing block and fiber reinforcing block is supported inside the package shell and has one end connected to side of the LN waveguide chip supported by spacer combination inside the shell andthe other end extending beyond the shell and as the input or output interface, with the joint to the shell being adhered. By means of improved coupling technology and structure, the light waveguide in the modulator is coupled with fiber precisely and reliably with high stability, low additional loss, low lkight reflection, and insertion loss not affected by temperature change and mechanical vibration.

Description

technical field [0001] The invention relates to a method and a coupling device for realizing the coupling of an optical waveguide and an optical fiber for a lithium niobate modulator, belonging to the improvement of communication optical devices. Background technique [0002] With the rapid development of the information industry, communication optical devices have also made great progress in recent years, with various types and different principles. In order to meet the needs of optical fiber communication, most communication optical devices use optical fiber as the input and output interface. Similar to microelectronic chips, optical fibers or fiber arrays are used in optical devices to input optical signals into optical chips, and then output processed optical signals from them. Therefore, how to achieve precise coupling between optical fiber or optical fiber array and optical chip, obtain insertion loss independent of temperature change and mechanical vibration, and mai...

AI Technical Summary

Problems solved by technology

[0018] The disadvantages of the silicon V-groove flip-chip technology are: 1. The silicon V-groove requires high precision and is difficult to manufacture; 2. The thermal expansion coefficients of silicon, quartz, and LN are different, and the glue used for bonding will be produced when the temperature changes. In severe cases, the bonding layer will be damaged; at the same time, there will be relative displacement between the silicon chip and the LN chip, resulting in insertion loss drifting with temperature

4. Due to the flip-chip structure, it is inconvenient to operate and easy to damage when fixing the chip in the tube shell and realizing the electrical connection

However, existing designs of this type still have deficiencies in terms of temperature stability and mechanical properties.

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