Thermally driven on line test structure of transverse breaking strength of film in microelectronic mechanical system

Abstract

The present invention is thermally driven in-situ test structure of transverse breaking strength of film in microelectronic mechanical system and belongs to the field of in-situ test technology in microelectronic mechanical system. The test structure includes fixing end for beam to be tested, beam to be tested, beam, V-shaped executor heating beam, fixing end for heating beam and conducting film. The beam to be tested has one end fixed to the fixing end for beam to be tested and the other end fixed to one end of the beam, the beam has its two sides connected to V-shaped executor heating beam, the V-shaped executor heating beam has its other end connected to the fixing end for heating beam, the conducting film is on the fixing end for heating beam, the fixing end for heating beam and the fixing end for beam to be tested are fixed onto the upper plane of SiN layer, and below the SiN layer there are SiO2 layer and substrate successively.

Description

technical field [0001] The invention relates to an on-line testing structure for the transverse fracture strength of a micro-electro-mechanical system (MEMS), which belongs to the technical field of on-line testing in micro-electro-mechanical systems. Background technique [0002] The traditional test structure generally does not contain a driving source, and the driving force required for testing is added. This test structure has the following disadvantages: (1) the external driving force is difficult to control and is easily disturbed by external factors; (2) the test efficiency is low; (3) the test structure occupies a large area. The MEMS film transverse fracture strength on-line testing structure is a new method that integrates the V-shaped thermal actuator and the beam to be tested on the same chip, and uses the V-shaped thermal actuator to drive the beam to be tested to break, thereby realizing a new method of online testing of the fracture strength. Kapels was the f...

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Problems solved by technology

This test structure has the following disadvantages: (1) The external driving force is difficult to control and is easily disturbed by external factors; (2) The test efficiency is low; (3) The test structure occupies a large area

Kapels was the first to propose a test structure using thermal execution as the source of driving force required to test the fracture strength. He integrated the U-shaped thermal actuator and the structure to be tested on the same chip (H.Kapels, et.al, "Fracture strength andfatigue of polysilicon determined by a novel thermal actuator, "IEEEtransaction on electron devices, pp.97-103, NO.7, July1999), the MEMS film rupture strength is determined by the interdigital pointer reading, but the disadvantage of this structure is that the measurement The accuracy is greatly affected by the process, and the reading is troublesome

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