Anisotropic conductive connecting material

Abstract

The anisotropic conductive connection material does not cause cracks on the electrodes even when a plastic substrate with ITO electrodes is used when the opposite substrates are anisotropically connected, and the connection reliability does not decrease after aging. The anisotropic conductive connection material composed of conductive particles dispersed in the insulating adhesive is arranged between the connection terminals of the first and second substrates, and the thermal compression bonding process ensures the conduction between the two and makes them connect. As electroconductive particle, the base elastic modulus in the pressure bonding temperature is 200% or less of the elastic modulus of the 1st board|substrate in the pressure bonding temperature. Moreover, it is more preferable to use what the elastic modulus at a pressure bonding temperature is 60 to 90% of the elastic modulus at 25 degreeC as electroconductive particle.

Description

technical field [0001] The present invention relates to an anisotropic conductive connection material suitable for the manufacture of a liquid crystal panel using a plastic substrate. Background technique [0002] A liquid crystal panel having a liquid crystal element in which liquid crystal is sealed between a pair of transparent glass substrates is used in commonly used electronic devices such as mobile phones and mobile terminals. [0003] Such a liquid crystal panel is an anisotropic conductive connection in which conductive particles are dispersed in a thermosetting insulating adhesive between the ITO electrodes on the glass substrate of the liquid crystal element and the connection terminals of the flexible substrate. The material is bonded by heat and pressure to ensure conduction, and at the same time, the two are connected to make it. [0004] Recently, in order to reduce the weight and thickness of liquid crystal panels, attempts have been made to replace transpar...

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Problems solved by technology

[0006] A countermeasure to this problem is to use conductive particles that form a metal coating on a resin core that deforms under a relatively low load. In the case of a change in the size of the connection part, it cannot follow this change, and in particular, there is a problem that the connection reliability is greatly reduced after aging

[0007] The above-mentioned problems not only occur in the manufacture of liquid crystal panels, but also sometimes occur when using substrates that are easily deformed under the thermocompression bonding conditions of anisotropic conductive connecting materials, or when using plastically deformable conductive particles.