Apparatus and method for washing and drying of semiconductor wafer

A technology of semiconductors and wafers, applied in chemical instruments and methods, cleaning methods and utensils, semiconductor/solid-state device manufacturing, etc., to achieve good watermark effects, improved cleaning and drying effects

Inactive Publication Date: 2004-06-02
SIEMENS AG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These watermarks in turn lead to defects in ICs

Method used

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  • Apparatus and method for washing and drying of semiconductor wafer
  • Apparatus and method for washing and drying of semiconductor wafer
  • Apparatus and method for washing and drying of semiconductor wafer

Examples

Experimental program
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Embodiment Construction

[0016] figure 1 A cross section of the device 10 of the present invention is schematically shown. The apparatus 10 can easily wash and dry one or more semiconductor wafers W substantially free of water marks (water spots) after drying. Apparatus 10 includes airtight enclosure 12 , wash tank 14 , water support and lift 16 , water cooling unit 18 , and pump 20 . Other elements within device 10 or housing 12 are not shown, but may be similar to commercially available devices. Such equipment is commercially available from Dai Nippon Screen (DAS) of Japan.

[0017] As shown, the cleaning tank 14 has a three-dimensional shape, with four vertical walls 22, a lower portion 26, and a toplip 28, without a top. Tank 14 is continuously filled with deionized water (DIW) 60 through supply pipe 30 through one tank wall 22 near bottom 26 of tank 14 . There is a sealing ring 32 around the pipe 30 passing through the wall of the airtight enclosure 12 to the tank 14 . Pipe 30 is connected t...

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PUM

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Abstract

Apparatus and method are provided for improved washing and drying of semiconductor wafers utilizing an enhanced "Marangoni effect" flow of liquid off of the wafers for superior prevention ofwatermarks (water spots) on integrated circuits (ICs) on the wafers. The apparatus includes a housing 12 which may be hermetically sealed, an open-top wash tank 60 within a lower part of the housing, a moveable rack 16 for holding the wafers either in the tank for washing or in an upper part of the housing for drying, apparatus 34 for supplying chilled (near freezing) de-ionized water (DIW) to a lower part of the tank, the DIW flowing within the tank and overflowing the top thereof, a pump 20 for draining overflowing DIW from the housing, and apparatus 40 for supplying to the housing organic vapor such as isopropyl alcohol (IPA) in a dry gas such as nitrogen. During wafer drying operation of the apparatus the pressure within the housing is kept at about one Torr or less.

Description

technical field [0001] The present invention relates to improved apparatus and methods for cleaning and drying semiconductor wafers during their processing into integrated circuits to reduce or inhibit the occurrence of water marks (or water spots), which are a failure factor in high density ICs main reason. Background technique [0002] When semiconductor wafers are fabricated into integrated circuits (ICs), the wafers need to be thoroughly cleaned to remove residual chemicals, small particles, and other contamination that occur during the various processing steps. Ultra-clean cleaning of wafer surfaces is very important to completely remove minute traces of contamination. [0003] There are many commercial semiconductor wafer cleaning and drying systems. The present invention can utilize those systems that utilize deionized water (DIW) in combination with organic vapors such as isopropanol (IPA) in an atmosphere such as dry nitrogen. These systems clean and dry wafers a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304H01L21/00
CPCH01L21/67028H01L21/67023Y10S134/902H01L21/02057H01L21/67034H01L21/67057
Inventor 赤津广之拉维库马·拉马钱德兰
Owner SIEMENS AG
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