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Computer device, case and water-cooling heat dissipation device

A technology for computer devices and casings, which is applied in computing, cooling/ventilation/heating transformation, casings/cabinets/drawer parts, etc. Effect

Pending Publication Date: 2022-07-29
COOLER MASTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the computing power of the central processing unit and the display card are becoming stronger and stronger, the heat generated by them will also increase accordingly. Therefore, when the central processing unit and the display card are running, the waste heat generated by the central processing unit and the display card will interact and increase the temperature of the computer. The difficulty of heat dissipation

Method used

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  • Computer device, case and water-cooling heat dissipation device
  • Computer device, case and water-cooling heat dissipation device
  • Computer device, case and water-cooling heat dissipation device

Examples

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Embodiment Construction

[0101] see Figure 1 to Figure 5 . figure 1 It is a three-dimensional schematic diagram of the computer device according to the first embodiment of the present invention. figure 2 for figure 1 Schematic diagram of the partial decomposition. image 3 for figure 2 Schematic diagram of the partial decomposition. Figure 4 for image 3 Schematic diagram of decomposition. Figure 5 for image 3 A schematic plan view of the inner side plate of the first heat dissipation plate.

[0102] The computer device 10 of this embodiment includes a casing 100 , an electronic component 200 and a water cooling component 300 .

[0103] The casing 100 of this embodiment includes a plurality of cover plates 110 - 140 , a first heat dissipation plate 150 and a second heat dissipation plate 160 . The cover plate bodies 110 - 140 , the first heat dissipation plate body 150 and the second heat dissipation plate body 160 together define an accommodating space S. That is to say, the first hea...

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Abstract

The invention discloses a computer device, a case and a water-cooling heat dissipation device. The computer device comprises the case, an electronic assembly and a water-cooling assembly. A containing space is defined by the machine shell, and at least one side of the machine shell is provided with an internal flow channel, a fluid inlet and a fluid outlet, wherein the fluid inlet and the fluid outlet are communicated with the internal flow channel. The electronic component is located in the accommodating space. The water cooling assembly comprises a first water cooling head and a water cooling row. The first water cooling head is in thermal contact with the electronic component. The first water-cooling head, the water-cooling row and an internal flow channel on at least one side of the machine shell are communicated to form a circulating flow channel. The fluid inlet and the fluid outlet of the machine shell are communicated with the water cooling row and the first water cooling head respectively.

Description

technical field [0001] The present invention relates to a computer device, a casing, and a water-cooled heat-dissipating device, in particular to a computer device with a water-cooled head, a casing and a water-cooled heat-dissipating device. Background technique [0002] Generally speaking, a computer mainly includes a casing, a power supply, a motherboard, a central processing unit, a graphics card and an expansion card. The power supply and the main board are installed in the casing, and the central processing unit, the display card and the expansion card are installed on the main board. When the computer is running, the central processing unit is responsible for data operations, and the graphics card is responsible for image operations, both of which generate a lot of heat. Therefore, computer manufacturers generally add fans to dissipate heat from the CPU and the graphics card. When the fan is running, it guides the external air flow through the central processing uni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/20
CPCH05K7/20218H05K5/0217G06F1/20G06F2200/201H05K7/20254H05K7/20263H05K7/20272H05K7/20409
Inventor 陈盈君魏祐得林宗伟
Owner COOLER MASTER CO LTD
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