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Microphone reinforcing flexible circuit board and preparation method thereof

A flexible circuit board, flexible circuit substrate technology, applied in the direction of printed circuit manufacturing, printed circuits, transducer circuits, etc., can solve the problem of microphone hole sound leakage, avoid microphone hole sound leakage, ensure high performance and high yield Effect

Pending Publication Date: 2022-07-26
MFLEX YANCHENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a microphone reinforced flexible circuit board and its preparation method to solve the problem that the flexible circuit board in the prior art needs to meet the requirements of the reinforcement grounding on the back of the microphone and avoid sound leakage from the microphone hole

Method used

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  • Microphone reinforcing flexible circuit board and preparation method thereof
  • Microphone reinforcing flexible circuit board and preparation method thereof
  • Microphone reinforcing flexible circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] This embodiment provides a preparation method of a microphone reinforced flexible circuit board, such as figure 1 shown, including the following steps:

[0054] S1: Provide metal reinforcing plate and flexible circuit substrate respectively;

[0055] S2: forming at least one first conductive through hole on the metal reinforcing plate, and forming at least one second conductive through hole on the flexible circuit substrate;

[0056] S3: Conduct conduction processing on the metal reinforcing plate and the flexible circuit substrate according to all the first conductive through holes and all the second conductive through holes by using the conductive glue to form a conductive circuit board;

[0057] S4 : punching out at least one microphone hole penetrating the conductive circuit board on the area of ​​the conductive circuit board except all the first conductive through holes and all the second conductive through holes to form a microphone reinforced flexible circuit bo...

Embodiment 2

[0106] This embodiment provides a microphone reinforced flexible circuit board, which is prepared by using the preparation method described in the first embodiment.

[0107] The microphone reinforced flexible circuit board in this embodiment can not only meet the requirement of reinforced grounding on the back of the microphone, but also avoid the problem of sound leakage through the microphone hole, thereby ensuring the high performance and high yield of the microphone.

[0108] The preparation method of the microphone reinforced flexible circuit board described in this embodiment is the same as the preparation method described in Embodiment 1. For details not described in this embodiment, please refer to Embodiment 1 and Figure 1 to Figure 8 The specific description is not repeated here.

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Abstract

The invention discloses a microphone reinforcing flexible circuit board and a preparation method thereof. The preparation method comprises the following steps: respectively providing a metal reinforcing plate and a flexible circuit substrate; at least one first conductive through hole is formed in the metal reinforcing plate, and at least one second conductive through hole is formed in the flexible circuit substrate; conducting the metal reinforcing plate and the flexible circuit substrate by using a conductive adhesive according to all the first conductive through holes and all the second conductive through holes to form a conducting circuit board; and punching at least one microphone hole penetrating through the conducting circuit board in the area of the conducting circuit board except for all the first conducting through holes and all the second conducting through holes to form the microphone reinforcing flexible circuit board. Electrical conduction between the metal reinforcing plate and the flexible circuit substrate is achieved, metal between the microphone hole and the metal reinforcing plate and metal between the microphone hole and the flexible circuit substrate are effectively isolated through the conductive adhesive, the requirement for reinforcing and grounding of the back face of the microphone is met, and the problem of sound leakage of the microphone hole is solved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board manufacturing, in particular to a microphone reinforced flexible circuit board and a preparation method thereof. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide (PI) or polyester film as the base material. Flexible circuit boards are widely used in electronic products because of their high wiring density, light weight, thin thickness and good bendability. [0003] Due to the light and thin characteristics of flexible circuit boards, operations such as beating, folding, and scarring are easy to occur during the use of electronic products, with low mechanical strength and easy cracking. Therefore, when electronic components are assembled on the surface of flexible circuit boards, it is generally The back of the element supports the element with a material with higher hardness to enhance t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R3/00H04R1/08H05K1/02H05K3/00H05K3/40
CPCH04R3/00H04R1/08H05K3/005H05K3/0061H05K3/4038H05K1/0215H05K1/0281
Inventor 陆云凤金小健
Owner MFLEX YANCHENG CO LTD
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