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Preparation method and application of thermoplastic shape memory epoxy resin

A flexible epoxy resin and epoxy resin technology, applied in the field of materials, can solve the problems of low fracture strain in mechanical properties and effective recycling of material shape memory effects, etc., to achieve improved fracture strain, excellent thermally induced shape memory performance, Effect of improving processing fluidity

Pending Publication Date: 2022-07-22
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, most of the shape memory epoxy resins in the current research are three-dimensional network cross-linked structures, which lead to the common problem of low fracture strain in terms of mechanical properties, and are limited to traditional pouring molding processes in terms of manufacturing and processing. Both limit the effective implementation of material shape memory effect and its recycling

Method used

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  • Preparation method and application of thermoplastic shape memory epoxy resin
  • Preparation method and application of thermoplastic shape memory epoxy resin
  • Preparation method and application of thermoplastic shape memory epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The first step, according to the molar ratio of 16:1, weigh 3.69g of bisphenol A diglycidyl ether and 0.37g of polypropylene glycol diglycidyl ether at room temperature, and add an equivalent of 1.05g of diethylene glycol amine, add 0.3 g of polytrimethylene adipate plasticizer with a molecular weight of 2000; use a vortex shaker to stir and mix for 5 minutes;

[0027] The second step is to sonicate the mixed system in an ultrasonic cleaner for 5 minutes, then vortex stirring, and repeat the operation several times until the system becomes transparent and free of bubbles; the third step is to pour the evenly mixed epoxy resin system into In the mold, step heating and curing of 60°C / 2h+80°C / 2h+120°C / 2h is performed in an oven to obtain a thermoplastic shape memory epoxy resin.

[0028] The chemical structural formula of the prepared thermoplastic shape memory epoxy resin is as follows: figure 1 shown. In the infrared spectrum test, the characteristic absorption peak of...

Embodiment 2

[0030] In the first step, according to the molar ratio of 12:1, 3.62g of bisphenol A diglycidyl ether and 0.48g of polypropylene glycol diglycidyl ether were weighed at room temperature, and an equivalent of 1.05g of diethylene glycol amine was added, Add 0.4 g of polycaprolactone diol plasticizer with a molecular weight of 1000; use a vortex shaker to stir and mix for 5 minutes;

[0031] The second step is to sonicate the mixed system in an ultrasonic cleaner for 5 minutes, then vortex stirring, and repeat the operation several times until the system becomes transparent and free of bubbles; the third step is to pour the evenly mixed epoxy resin system into In the mold, step heating and curing of 60°C / 2h+80°C / 2h+120°C / 2h is performed in an oven to obtain a thermoplastic shape memory epoxy resin.

[0032] The mechanical properties of the prepared thermoplastic shape memory epoxy resin are as follows: image 3 shown, with a high fracture strain as high as 531.27%, which is favo...

Embodiment 3

[0036] In the first step, according to the molar ratio of 12:1, 3.62g of bisphenol A diglycidyl ether and 0.38g of polyethylene glycol diglycidyl ether were weighed at room temperature, and an equivalent amount of 1.05g of diethylene glycol was added. Amine, add 0.5g of polyester plasticizer (brand CCP-D1050) with a molecular weight of 2000; use a vortex shaker to stir and mix for 5min;

[0037] The second step is to sonicate the mixed system in an ultrasonic cleaner for 5 minutes, then vortex stirring, and repeat the operation several times until the system becomes transparent and free of bubbles; the third step is to pour the evenly mixed epoxy resin system into In the mold, step heating and curing of 60°C / 2h+80°C / 2h+120°C / 2h is performed in an oven to obtain a thermoplastic shape memory epoxy resin.

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Abstract

The embodiment of the invention discloses a preparation method and application of thermoplastic shape memory epoxy resin, and the preparation method comprises the following steps: uniformly mixing bifunctional rigid epoxy resin, bifunctional flexible epoxy resin, a bifunctional monoamine compound and a polyester plasticizer according to a mass ratio of (1-20): 1; the molar ratio of the mixture of the bifunctional rigid epoxy resin and the bifunctional flexible epoxy resin to the bifunctional monoamine compound is 1: (0.5-1.5), and the content of the polyester plasticizer is 1-10wt%; and curing the mixed components at 25-60 DEG C for 1-4 hours, continuously heating to 70-100 DEG C, curing for 1-4 hours, continuously heating to 110-140 DEG C, and carrying out curing reaction for 1-4 hours to obtain the thermoplastic shape memory epoxy resin. The fracture strain of the material is improved by regulating and controlling the molar ratio of the bifunctional rigid and flexible structure epoxy resin oligomer.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of materials, in particular to a preparation method and application of a thermoplastic shape memory epoxy resin. Background technique [0002] Shape memory polymers are a class of polymers with a certain initial shape. Under the action of specific stimuli such as heat, magnetic field, electricity, light, etc., any temporary shape can be obtained through shape editing. Smart materials that automatically return to their original shape. Based on the shape change of shape polymer intelligence, it not only has practical applications in cable protection, pipe joints and other fields, but also has great application potential in biomedical, aerospace, smart equipment and other fields. [0003] Among many shape memory polymers, shape memory epoxy resins have many excellent properties, such as good thermal stability, high mechanical strength, good environmental corrosion resistance, low volu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L67/02C08L67/04
CPCC08L63/00C08L2205/025C08L2201/12C08L67/02C08L67/04Y02E60/10
Inventor 陈少军刘俊卓海涛
Owner SHENZHEN UNIV
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