Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board

A circuit board and electrode layer technology, applied in the direction of circuits, printed circuits, printed circuits, etc., can solve the problems of protective layer adhesion, sheet resistance and environmental reliability that are difficult to meet the expected standards

Pending Publication Date: 2022-07-12
DONGWOO FINE CHEM CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Protective layers made from this material struggle to meet desired standards in terms of adhesion, sheet resistance, and environmental reliability (corrosion)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board
  • Circuit board
  • Circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] [Best way]

[0026] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

[0027] figure 1 is a cross-sectional view showing the structure of the circuit board according to the present invention.

[0028] like figure 1 As shown, the circuit board of the present invention may include a base layer 110, a seed layer 120, a first electrode layer 130, an insulating layer 140, a second electrode layer 150, a via hole 160, a surface treatment layer 170, a passivation layer 180, etc. .

[0029] The base layer 110 is a substrate of a circuit board, and may be made of a glass material. The size of the base layer 110 may be 1100 mm×1250 mm. The thickness of the base layer 110 may be in the range of 0.4 mm to 0.7 mm.

[0030] In addition to glass, the base layer 110 may be configured in the form of a film, such as a PI film, a COP film, a PET film, or the like.

[0031] The seed layer 120 may be formed on the base l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a circuit board. The circuit board includes: a base layer; an electrode layer, which is formed on the substrate layer; a passivation layer that is formed on the electrode layer while opening a portion of the electrode layer; and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70% to 40% copper and 30% to 60% nickel.

Description

technical field [0001] The present invention relates to a circuit board. In particular, the present invention relates to a circuit board capable of preventing or minimizing a decrease in adhesion of a surface treatment layer for preventing corrosion of a metal electrode layer, an increase in sheet resistance, and a decrease in environmental reliability. Background technique [0002] The circuit board may include a base layer, an electrode layer formed on the base layer, and the like. The electrode layer is usually made of metal, which can be corroded by moisture etc. when exposed. In order to prevent such corrosion of the electrode layer, a surface treatment layer is formed on the electrode layer. [0003] Korean Patent Application Publication No. 10-2014-0000608 (Package on package devices and methods of packaging semiconductor dies) discloses forming protective layers on sidewalls of metal pillars. The protective layer is made of tin (Sn), gold (Au), copper germanium al...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01L33/62
CPCH05K1/0275H01L33/62H05K3/4605H05K3/388H05K1/0306H05K2201/0338H05K3/14H05K3/465H05K3/282H05K3/0011H05K2203/1333H05K3/284
Inventor 朴基晙鲁圣辰李俊九
Owner DONGWOO FINE CHEM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com