High-temperature-resistant and high-strength epoxy adhesive capable of being cured at medium and low temperatures and preparation method thereof

Abstract

The invention relates to the field of high polymer materials and preparation, and particularly discloses a high-temperature-resistant and high-strength epoxy adhesive capable of being cured at medium and low temperatures and a preparation method of the high-temperature-resistant and high-strength epoxy adhesive capable of being cured at medium and low temperatures. The curing temperature of the adhesive is effectively reduced, and meanwhile, the high-temperature adhesive property of the adhesive is remarkably improved. And the viscosity of the adhesive is adjusted through the filler. The epoxy adhesive can be cured at medium and low temperature (not more than 110 DEG C), and the tensile-shear strength at 250 DEG C is not less than 6.5 MPa. The epoxy adhesive provided by the invention is simple in preparation method, mild in curing condition and suitable for construction operation in various occasions.

Description

A medium and low temperature curing high temperature resistant high strength epoxy adhesive and preparation method thereof technical field The present invention relates to a kind of epoxy resin adhesive and preparation method thereof, be specifically related to a kind of medium and low temperature curing high temperature resistance High-strength epoxy adhesive and preparation method thereof, said medium and low temperature curing, high temperature resistance and high strength mean that the curing temperature is not high The pull-down shear strength at 110 DEG C and 250 DEG C is not less than 6.5MPa, which belongs to the field of polymer material preparation. Background technique Due to the existence of polar chemical structures such as epoxy groups, hydroxyl groups, and ether bonds in its structure, epoxy resins can be combined with various The surface of the material has a strong interaction and is used in conjunction with the curing agent. It is an adhesive with exce...

AI Technical Summary

Problems solved by technology

[0004] In addition, high-temperature-resistant adhesives generally have technical problems such as long gel time, high curing temperature (usually above 120°C), and long curing time, which seriously limit their application in aircraft bonding.

With the increasingly harsh thermal environment of aircraft service, the high temperature resistance requirements for epoxy adhesives are increasing day by day. At the same time, it is necessary to take into account its manufacturability. The current commercial epoxy adhesives can no longer meet the demand.