Single-component thermal interface material and preparation method thereof

Abstract

The invention discloses a single-component thermal interface material and a preparation method thereof. The single-component thermal interface material is prepared from the following raw material components in percentage by mass: 1 to 10 percent of vinyl-terminated polysiloxane, 0.1 to 3.6 percent of terminated hydrogen-containing polysiloxane, 0.1 to 3.4 percent of side hydrogen-containing polysiloxane, 0.01 percent of catalyst, 0.003 percent of inhibitor and 85 to 95 percent of modified filler. The modified filler is silane coupling agent modified heat-conducting powder. The single-component thermal interface material provided by the invention has high thermal conductivity, high elongation, low modulus, low adhesive layer thickness and low thermal resistance, has excellent infiltration performance, can meet the strict requirements of chip packaging process flow and technology, has high application reliability, can provide a proper, stable and healthy working temperature environment for chips, and has wide application prospect. And the service life and efficiency of the chip are improved.

Description

technical field [0001] The invention belongs to the technical field of thermal management of chips and electronic equipment, and more particularly relates to a single-component thermal interface material and a preparation method thereof. Background technique [0002] Thermal management is one of the key requirements in all electronic equipment fields. The increasing demand for integrated chip packaging technology puts forward higher requirements on the performance of electronic devices, but the increase in power and size reduction of chips will lead to a significant increase in heat, which greatly affects the efficiency and life of chips and electronic devices. [0003] Thermal Interface Material (TIM) is applied between the surface of the chip and the heat sink to export the heat to the outer area of ​​the semiconductor package, effectively ensuring the normal operation of the chip. The traditional thermal interface materials are mainly thermal grease, thermal pad and ther...

AI Technical Summary

Problems solved by technology

The service life of thermal conductive silicone grease is short, and it is easy to cause the overflow of small molecular substances and dry powder, which will pollute the outside world and cause a decrease in thermal conductivity; thermal conductive gaskets are difficult to meet the production process requirements of chip packaging, and cannot be used for automated large-scale dispensing operations. It is also difficult to meet the ultra-low thickness requirements of the chip

[0004] Common thermal gels on the market often have high thermal conductivity, low thermal resistance, high flexibility (high flexibility refers to high elongation at break), and low adhesive thickness (low adhesive thickness refers to the filler particle size used is low) The mismatch of these key parameters cannot be considered one by one; moreover, conventional gels have low reliability requirements and cannot meet the stringent requirements of chip packaging.

The use of conventional thermal interface materials for chip packaging in high heat flux environments will lead to problems such as excessive chip temperature, abnormal function, and reduced lifespan.

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