Adhesive with double functions of electromagnetic shielding and heat conduction for electronic packaging and preparation method of adhesive

A technology of electromagnetic shielding and electronic packaging, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of high cost, complex preparation method, restricted development, etc., and achieve high peel strength and high thermal conductivity. , the effect of low thermal expansion coefficient

Active Publication Date: 2022-05-17
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its complex preparation method and high cost also limit its further development.

Method used

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  • Adhesive with double functions of electromagnetic shielding and heat conduction for electronic packaging and preparation method of adhesive
  • Adhesive with double functions of electromagnetic shielding and heat conduction for electronic packaging and preparation method of adhesive
  • Adhesive with double functions of electromagnetic shielding and heat conduction for electronic packaging and preparation method of adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Add 5 parts of silicone-modified epoxy resin, 30 parts of bisphenol A epoxy resin, 5 parts of polypropylene glycol diglycidyl ether and 5 parts of additives into the double planetary dynamic mixing kettle in sequence, turn on revolution stirring and high-speed dispersion, Stir for 1 hour at a temperature of 25°C, add 10 parts of Ni nanoparticle / C composite material and 37 parts of spherical alumina, stir for 0.5 hours, add 7 parts of dicyandiamide and 0.5 parts of organic urea, stir for 1 hour, and finally add gas phase 0.5 parts of silicon dioxide, stirred, and after the infiltration of gas phase silicon dioxide, the vacuum pump was turned on for vacuum degassing, the vacuum pressure was 0.09MPa, and after keeping for 0.5h, an electromagnetic shielding and heat conduction dual-function adhesive for electronic packaging was obtained. The stirring speed is 50r / min, and the high-speed dispersion speed is 800r / min.

[0043] The Ni nanoparticle / C composite material is carri...

Embodiment 2

[0049] Referring to the preparation method of Example 1, the mass ratio of Ni nanoparticles / C composite material to spherical alumina was changed to 20:27.

Embodiment 3

[0051]Add 8 parts of polyurethane modified epoxy resin, 30 parts of bisphenol A epoxy resin, 8 parts of o-cresyl glycidyl ether and 5 parts of additives into the double planetary dynamic mixing kettle in sequence, turn on revolution stirring and high-speed dispersion, and Stir for 1 hour at a temperature of 25°C, add 10 parts of Fe nanoparticle / C composite material and 27.8 parts of spherical alumina, stir for 0.5 hours, add 10 parts of dicyandiamide and 0.7 parts of organic urea, stir for 1 hour, and finally add gas phase two 0.5 parts of silicon oxide, stirred, and after the fumed silica was infiltrated, the vacuum pump was turned on for vacuum degassing, the vacuum pressure was 0.09MPa, and after keeping for 0.5h, an electromagnetic shielding and thermally conductive dual-functional adhesive for electronic packaging was obtained. The rotating speed is 50r / min, and the high-speed dispersion rotating speed is 800r / min.

[0052] The Fe nanoparticles / C composite material is car...

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Abstract

The invention discloses an electromagnetic shielding and heat conduction dual-function adhesive for electronic packaging and a preparation method thereof, and relates to the field of adhesives. A magnetic metal nanoparticle and porous carbon composite material is prepared, a porous three-dimensional structure is formed through grinding and calcining, and the porous three-dimensional structure is compounded into epoxy to form a continuous heat conduction channel. Compared with other heat-conducting filler compounded epoxy resin materials, the epoxy resin with the heat-conducting network structure formed by the magnetic metal nanoparticles and the porous carbon composite material has the advantages that the heat-conducting network structure is formed by the continuous heat-conducting network structure under the low filler addition amount; the adhesive has excellent performance of very high thermal conductivity, electromagnetic wave shielding function, low thermal expansion coefficient and high peel strength.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an adhesive with dual functions of electromagnetic shielding and heat conduction for electronic packaging and a preparation method thereof. Background technique [0002] With the rapid development of mobile communication technology and electronic technology, mobile communication equipment has achieved revolutionary development. The increasing miniaturization and high integration of smart electronic devices has led to the development of electronic devices in the direction of miniaturization, high frequency and high power, which has led to increasing electromagnetic interference and heat dissipation problems. The electromagnetic radiation generated by electronic devices will not only interfere with the normal operation of other equipment, but also cause damage to the ecological environment and pose hidden dangers to human health. Electromagnetic shielding can effectively solve the problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04
CPCC09J163/00C09J11/04C08L2203/206C08K2201/01C08K2201/011C08K2201/008C08K2003/0862C08K2003/0856C08K2003/0843C08L63/00C08K3/08C08K7/24C08K7/18Y02A30/00
Inventor 岳海龙李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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