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Preparation method of ultra-pure, ultra-thick and compact aluminum film

An ultra-thick, aluminum film technology, applied in the field of ultra-pure, ultra-thick, dense aluminum film preparation on the surface of metal workpieces to be plated, to achieve high purity, high film density, and good appearance quality

Active Publication Date: 2022-05-13
SHENYANG FORTUNE PRECISION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the defects existing in the existing ultra-thick aluminum film preparation method and provide a method for preparing an ultra-pure, ultra-thick, dense aluminum film. The technical problem to be solved is that the thickness of the aluminum film is greater than 50 microns. At the same time, the aluminum film has ultra-high purity, smooth surface, and dense film layer; it is also suitable for complex workpiece surfaces

Method used

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  • Preparation method of ultra-pure, ultra-thick and compact aluminum film
  • Preparation method of ultra-pure, ultra-thick and compact aluminum film
  • Preparation method of ultra-pure, ultra-thick and compact aluminum film

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preparation example Construction

[0030] The preparation method of a kind of ultra-pure, ultra-thick, dense aluminum film that the present invention proposes, comprises the following steps: firstly after the workpiece to be plated is cleaned through the cleaning line, enters the vacuum chamber, and when the vacuum degree reaches 10 -2 -10 -4 After Pa, inert gas is introduced into the vacuum chamber to make the vacuum degree reach 10Pa-10 -1 Pa; turn on the pulse electrode installed in the vacuum chamber to stimulate the formation of plasma, and at the same time apply a negative DC bias to the workpiece to be plated, and use the plasma to perform in-situ sputtering cleaning on the surface of the workpiece to be plated; then turn on the magnetron sputtering power supply according to the demand, adjust the reduction The amount of inert gas charged, through the magnetron sputtering high-purity aluminum target, the sputtered aluminum atoms are excited and ionized in the plasma, and at the same time, because the wor...

Embodiment

[0042] The sheet-shaped nickel-based alloy material is used as an example for the workpiece to be plated.

[0043] 1. Install pure aluminum targets with a purity greater than 99.99% in the vacuum chamber;

[0044] 2. The workpiece to be plated is cleaned by an ultrasonic cleaning line, and thoroughly dried after dewaxing, degreasing and degreasing;

[0045] 3. Install the workpiece to be plated, the distance between the workpiece to be plated and the target is 60-140mm, and the optimal distance is 100mm;

[0046] 4. Vacuuming, the background vacuum is better than 3x10 -3 Pa;

[0047] 5. Argon filling 1-10 -1 Pa, turn on the pulse plasma generator, load the workpiece to be plated with a negative bias voltage, and perform sputter cleaning on the workpiece to be plated for 5-10 minutes, and the best time is 8 minutes;

[0048] 6. Adjust the amount of argon gas, apply a bias voltage of -100V to -200V to the workpiece to be plated, and turn on the magnetron sputtering power sup...

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Abstract

The invention relates to a preparation method of an ultra-pure, ultra-thick and compact aluminum film, which adopts a magnetron sputtering technology and an ion intervention (ion plating) mode to form an ultra-thick aluminum film (or aluminum coating) with the thickness of more than 50 microns on the surface of a metal (or alloy material), the porosity of the film layer is less than 1%, the purity of the film layer is more than 99%, and the thickness of the film layer is more than 50 microns. And good interface bonding force with a to-be-plated workpiece is achieved. The method can be used for decoration of parts in the fields of 3C and the like, and surface treatment of metal (or alloy) parts in the fields of semiconductor equipment, integrated circuit equipment and the like.

Description

technical field [0001] The invention belongs to the field of material surface treatment industry, in particular to a method for preparing an ultra-thick, ultra-pure and dense aluminum film on the surface of a metal (or alloy) workpiece to be plated. Background technique [0002] Aluminum film (aluminum coating) is widely used in mirrors, plastic and metal surface metallization decoration and electromagnetic Functional film layers such as shielding, conductivity and corrosion resistance. [0003] However, with the development of technology, in some special application scenarios, the requirements for the thickness of the aluminum film on the surface of the substrate, the surface smoothness of the aluminum film, and the purity of the aluminum film are getting higher and higher, in order to meet the needs of ultra-clean environments, high corrosion resistance, high The application environment of conductivity and the need for special post-treatment of aluminum film; due to the l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/14C23C14/58
CPCC23C14/35C23C14/14C23C14/5826
Inventor 何向军张少杰
Owner SHENYANG FORTUNE PRECISION EQUIP CO LTD
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