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Polyurethane pouring sealant as well as preparation method and application thereof

A technology of potting glue and polyurethane, which is applied in the field of polyurethane materials, can solve the problems of ignoring the low temperature resistance and bonding performance of potting glue, achieve environmental friendliness of raw materials and processes, improve mechanical strength and bonding strength, and insulate and flame retardant excellent effect

Active Publication Date: 2022-04-12
LIMING RES INST OF CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN110272710A discloses a polyurethane potting compound suitable for electronic sensors and its preparation method. The method uses castor oil and polyether polyol in combination, and adds a flame retardant, so that the potting compound has excellent flame retardancy and insulation Performance, but ignores the low temperature resistance and adhesive performance of the potting compound

Method used

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  • Polyurethane pouring sealant as well as preparation method and application thereof
  • Polyurethane pouring sealant as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of component A: Add 25g type IV hydroxyl-terminated polybutadiene, 15g plasticizer DOP and 10g polyoxypropylene diol with a molecular weight of 2000 into the reactor, vacuum dehydrate at 95-100°C, until the moisture content is <0.03%; then lower the temperature to 50-55°C, add 55g of isocyanate MDI, and keep the reaction temperature of the system at 75-80°C until the NCO% content of the system reaches 16.5%; the air bubbles can be removed, and the temperature is lowered to room temperature to obtain A component.

[0033] Preparation of component B: 30g of epoxidized special butyl hydroxy, 10g of polyoxypropylene diol with a molecular weight of 2000, 10g of plasticizer DOTP, 15g of chain extender N,N-dihydroxyisopropylaniline, 20g of retarder Flame DMMP, 5g of flame retardant aluminum hydroxide and 2g of reinforcing carbon black were added to the reactor, vacuum dehydrated at 95-100°C until the moisture content was <0.03%; then cooled to 45-50°C, and 0.5g of ...

Embodiment 2

[0036] Preparation of component A: Add 25g V-type hydroxyl-terminated polybutadiene, 15g plasticizer DOP and 10g polyethylene oxide diol with a molecular weight of 2000 into the reactor, and vacuum dehydrate at 95-100°C. until the moisture content is <0.03%; then lower the temperature to 50-55°C, add 30g of isocyanate MDI and 30g of isocyanate LMDI, and keep the reaction temperature of the system at 75-80°C until the NCO% content of the system reaches 15.5%; to room temperature to obtain component A.

[0037] Preparation of component B: 20g epoxidized special butyl hydroxy, 10g multifunctional special butyl hydroxy, 10g polymer polyol DL2000, 10g plasticizer DOTP, 5g chain extender butanediol, 20g flame retardant TCPP, 5g Flame retardant antimony oxide and 3g of wear-resistant carbon black are added to the reactor, vacuum dehydrated at 95-100°C until the moisture content is <0.03%; then the temperature is lowered to 45-50°C, and 0.5g of organotin catalyst and 0.5g Silicone de...

Embodiment 3

[0040]Preparation of component A: Add 30g type IV hydroxyl-terminated polybutadiene, 20g plasticizer DINP and 10g polytetrahydrofuran ether diol with a molecular weight of 1000 into the reactor, and dehydrate under vacuum at 95-100°C until Moisture content <0.03%; then cool down to 50-55°C, add 60g of isocyanate LMDI, keep the reaction temperature of the system at 75-80°C, until the NCO% content of the system reaches 13.0%; the bubbles can be removed, and the temperature is lowered to room temperature to obtain A components.

[0041] Preparation of component B: 30g epoxidized special butyl hydroxy, 10g polyoxypropylene diol with a molecular weight of 2000, 20g plasticizer DINP, 10g chain extender ethyl hexanediol, 20g flame retardant DMMP, 5g Flame retardant ammonium polyphosphate and 2g of reinforcing carbon black were added to the reactor, and vacuum dehydrated at 95-100°C until the moisture content was <0.03%; then the temperature was lowered to 45-50°C, and 0.5g of organic...

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Abstract

The invention relates to a polyurethane pouring sealant and a preparation method and application thereof.The polyurethane pouring sealant is composed of a component A and a component B. The mass ratio of the component A to the component B is 40-60: 100, and the component A is prepared from, by weight, 10-40 parts of hydroxyl-terminated polybutadiene A, 5-20 parts of polymer polyol, 5-30 parts of plasticizer and 35-75 parts of isocyanate; the component B comprises the following raw materials in parts by weight: 20-60 parts of hydroxyl-terminated polybutadiene B, 5-30 parts of polymer polyol, 5-30 parts of a plasticizer, 5-25 parts of a chain extender, 5-40 parts of a flame retardant, 0.5-5 parts of carbon black, 0.01-1 part of a catalyst and 0.1-1 part of a defoaming agent; the hydroxyl-terminated polybutadiene A is a special hydroxyl-terminated polybutadiene with low functionality; the hydroxyl-terminated polybutadiene B is polyfunctional special hydroxyl-terminated polybutadiene and / or epoxidized special hydroxyl-terminated polybutadiene. The pouring sealant disclosed by the invention has the characteristics of high mechanical property, good adhesive property, excellent insulation and flame retardance and low-temperature resistance, and can be used for pouring and sealing electronic components such as cables.

Description

technical field [0001] The invention belongs to the field of polyurethane materials, and relates to a polyurethane potting glue and its preparation method and application. Background technique [0002] Due to its excellent characteristics, polyurethane potting adhesive has been widely used in various electronic components. However, some electronic components, such as cables, cable sockets, etc., have higher requirements for the comprehensive performance of their potting materials due to their own product characteristics, and require potting adhesives that have high mechanical properties, low temperature resistance, and bonding properties. Good, excellent insulation and flame retardancy. [0003] At present, most of the research on domestic polyurethane potting adhesives focuses on the improvement of single properties (such as mechanical properties, adhesive properties, flame retardancy, etc.), and there are few high-performance polyurethane potting adhesive products with mu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/04C09J11/06C08G18/66C08G18/48C08G18/32C08G18/69
Inventor 崔文康石雅琳苏丽丽郑直姜健尹璐
Owner LIMING RES INST OF CHEM IND
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