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Method for preparing fully-compact TiN/Cu material with golden yellow surface through two-step sintering

A golden yellow and dense technology, applied in the field of powder metallurgy, can solve the problems of difficult densification and difficult and complex forming of TiN-based materials, and achieve the effect of improving material strength

Active Publication Date: 2022-04-08
UNIV OF SCI & TECH BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a method for preparing a golden-yellow surface and fully dense TiN / Cu material, which solves the problem that TiN-based materials are difficult to form in complex, low temperature (< 1500℃) is difficult to densify

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A method for preparing a golden-yellow surface and fully dense TiN / Cu material, the specific preparation steps are as follows:

[0038] (1) Weigh the titanium powder and 30wt.% copper powder according to the ratio, then put them into a mixing tank for mixing, and after mixing for 2 hours, obtain a uniform mixed powder;

[0039] (2) Mix the mixed powder described in step (1) with 60vol.% gel solution, the content of HEMA in the gel solution is 70wt.%, the content of toluene is 15wt.%, and the content of BPO is 15wt.%, then add 0.1wt.% oleic acid and 0.2wt.% N-N dimethylaniline are mixed uniformly to obtain a mixed slurry.

[0040] (3) Pour the mixed slurry described in step (2) into a silica gel sheath, and dry at 40°C for 5 hours, and take out the green body;

[0041] (4) Put the green body described in step (3) into a degreasing and sintering furnace for degreasing. The degreasing temperature is 250° C. for 4 hours, and 600° C. for 2 hours to obtain a green body of th...

Embodiment 2

[0045] A method for preparing a golden-yellow surface and fully dense TiN / Cu material, the specific preparation steps are as follows:

[0046] (1) Titanium powder and 40wt.% copper powder are weighed according to the ratio, then put into a mixing tank for mixing, after mixing for 2 hours, a uniform mixed powder is obtained;

[0047](2) Mix the mixed powder described in step (1) with 50vol.% forming binder, SA accounts for 3wt.% in the forming binder, EBS accounts for 0.5wt.%, EVA accounts for 2.9wt.%, PE 6wt.%, PP 8wt.%, BASF 0.6wt.%, the balance is POM, then put it into the banbury granulator for banbury granulation, and then get the feed for injection;

[0048] (3) Injection-molding the feed material for injection described in step (2) at 170° C., and obtaining an injection green body after demoulding;

[0049] (4) Put the injection green body described in step (3) into an oxalic acid degreasing furnace for acid removal, the acid removal temperature is 130° C., and the acid...

Embodiment 3

[0054] A method for preparing a golden-yellow surface and fully dense TiN / Cu material, the specific preparation steps are as follows:

[0055] (1) Titanium powder and copper powder are weighed according to a certain ratio, wherein titanium powder accounts for 70wt.%, copper powder accounts for 30wt.%, then put into a mixing tank for mixing, after mixing for 3 hours, a uniform mixed powder;

[0056] (2) Put the mixed powder described in step (1) into the cold isostatic pressing bag of the target shape and vibrate it tightly, and carry out cold isostatic pressing after the cold isostatic pressing bag is strictly sealed. Hold the pressure at 200MPa for 70s, remove the sheath, and obtain the green body of the target shape.

[0057] (3) Put the green body described in step (2) into a sintering furnace for nitrogen sintering, the sintering temperature is 1100° C., and the holding time is 3 hours, to obtain a golden-yellow TiN / Cu sintered body;

[0058] (4) Carry out high-temperatu...

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Abstract

The invention discloses a method for preparing a fully-compact TiN / Cu material with a golden yellow surface through two-step sintering, and belongs to the field of powder metallurgy. Titanium powder and copper powder are evenly mixed according to a certain proportion, and the fully-compact TiN / Cu material with the golden yellow surface is obtained through forming and sintering. According to the method, in the nitrogen atmosphere sintering process, nitrogen reacts with titanium powder, and the TiN material with the golden yellow metal luster is generated in situ. Meanwhile, low-melting-point Cu serves as a binding phase and can be fully converted into a liquid phase in the high-temperature sintering process, combination between the binding phase and a hard phase is enhanced, and therefore full compactness of the TiN / Cu material is achieved. And finally, the TiN / Cu material is prepared through a powder metallurgy process, so that complexity and liberalization of the shape of a process product can be achieved, the utilization rate of raw materials can be increased, near-net forming is achieved, and the process cost is reduced.

Description

technical field [0001] The invention belongs to the field of powder metallurgy and provides a two-step sintering method for preparing a golden-yellow and fully dense TiN / Cu material on the surface. Background technique [0002] In recent years, as the material of choice for anti-corrosion and wear-resistant protective layers, cutting tools, electrodes and high-temperature-resistant components in the optoelectronic industry, TiN has excellent comprehensive properties such as high melting point, high hardness, and high corrosion resistance. Wide range of non-oxidizing ceramic materials. At the same time, the surface of TiN has a golden yellow metallic luster, which is used as a decoration material instead of gold, and is an ideal decoration film. The traditional preparation method of TiN material is to nitride titanium powder at 1700-1800°C for 1-4 hours under nitrogen atmosphere, but this method has high reaction temperature, low production efficiency, high energy consumptio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/10C22C1/05C22C29/16B22F3/22B22F3/04C22C1/10
Inventor 杨芳郭丽丽郭志猛陈存广隋延力杨松李延丽李泽北
Owner UNIV OF SCI & TECH BEIJING
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