Server, printed circuit board and press-fit manufacturing method of printed circuit board

A technology of printed circuit boards and production methods, which is applied in the fields of printed circuit manufacturing, laminated printed circuit boards, printed circuits, etc., can solve the problems of poor stability of circuit board products, affect product delivery, and high product scrap rate, and achieve improvement of voids problems, and the effect of improving resin voids

Pending Publication Date: 2022-03-25
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the poor fluidity of the current high-speed materials, the boards produced by the above methods of the prior art have resin voids and delamination of the boards
It leads to poor stability of circuit board products and high product scrap rate, which seriously affects product delivery

Method used

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  • Server, printed circuit board and press-fit manufacturing method of printed circuit board
  • Server, printed circuit board and press-fit manufacturing method of printed circuit board
  • Server, printed circuit board and press-fit manufacturing method of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] The present invention improves the problems of delamination and resin voids in lamination through high-speed plate pressing control technology, false copper design technology in empty areas, and PP glue content resin flow control technology.

[0061] In a preferred embodiment of the present invention, false copper (copper point or copper block) is added to the open area; the thick copper area increases the PP glue content (RC-72 to RC-75 or RC-77), and it will improve The void problem caused by the loss of pressure in the thick copper area.

[0062] In the present invention, adjust as follows for pressing production mode:

[0063] ①Number of laminated board layers: 2pnl / layer, 2 layers / stack; ②Arrangement method: 10 sheets of kraft paper above and below the chassis,

[0064] Add 5 sheets of kraft paper between each layer, and add aluminum sheets above and below the copper foil; ③The heating rate is ≥4°C / min.

[0065] In a preferred embodiment of the present invention,...

Embodiment 2

[0074] PP glue content resin flow control technology includes:

[0075] The thick copper area will increase the glue content of PP, from RC-72 to RC-75, the glue content will gradually increase, and the fluidity will increase in turn.

[0076] High-speed sheet press control technology includes:

[0077] Step 1: Dehumidify PP for 3 hours before production;

[0078] Step 2: Bake the browned board at a temperature of 100°C for 50 minutes and a heating rate of ≥4°C / min;

[0079] Step 3, typesetting: 2pnl / layer, 2 layers / stack, 10 sheets above and below the chassis, 5 sheets between layers, and aluminum sheets outside the copper foil;

[0080] Step 4, press plate.

Embodiment 3

[0082] In one embodiment of the present invention, the PP glue content resin flow control technology includes:

[0083] The thick copper area increases the glue content of PP, from RC-72 to RC-77. The gel content gradually increases, and the fluidity increases in turn.

[0084] High-speed sheet press control technology includes:

[0085] Step 1: Dehumidify PP for 5 hours before production;

[0086] Step 2: Bake the browned plate at a temperature of 130°C for 70 minutes; the heating rate is ≥4°C / min;

[0087] Step 3, typesetting: 2pnl / layer, 2 layers / stack, 10 sheets above and below the chassis, 5 sheets between layers, and aluminum sheets outside the copper foil;

[0088] Step 4, press plate.

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PUM

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Abstract

The invention belongs to the technical field of printed circuit board preparation, and discloses a server, a printed circuit board and a press-fit manufacturing method thereof. Through an open area false copper design technology, a PP glue content resin flow control technology and a high-speed plate lamination control technology, lamination manufacturing of the printed circuit board is carried out. The open area false copper design technology comprises the step of adding false copper into an open area. The PP glue content resin flow control technology comprises the step that the PP glue content is increased in a thick copper area, and RC-72 is increased to RC-75 or RC-77. Through the high-speed plate pressing control technology, the open area false copper design technology and the PP glue content resin flow control technology, the problems of pressing explosion plate layering and resin cavity are solved. According to the method, false copper (copper points or copper blocks) is added in an open area; the glue content of PP in the thick copper area is increased, and the problem of voids caused by pressure loss of the thick copper area can be solved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board preparation, and in particular relates to a server, a printed circuit board and a lamination method thereof. Background technique [0002] At present, in the existing technology, lamination: ①Number of layers: 2pnl / layer, 4 layers / stack; ②Arrangement method: 15 sheets of kraft paper on the upper and lower sides of the chassis, and 5 sheets of kraft paper are added between each layer; ③Heating rate≤3 ℃ / min (required ≥4℃ / min). [0003] In terms of design: ① no fake copper is added in the open area; ② the content of PP resin used in the thick copper area is the same as that of the non-thick copper area. [0004] Through the above analysis, the problems and defects in the prior art are: [0005] Due to the poor fluidity of the current high-speed materials, the boards produced by the above methods of the prior art have resin voids and delamination of the boards. As a result, the stabil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K3/00
CPCH05K3/10H05K3/0058
Inventor 冯强宋道远王艳锋李伯鑫樊锡超
Owner SHENZHEN SUNTAK MULTILAYER PCB
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