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High-frequency microwave automatic hole plugging and compacting device for multilayer board resin and using method of high-frequency microwave automatic hole plugging and compacting device

A high-frequency microwave and compaction device technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the damage and scrap of high-frequency microwave multilayer boards, wear and tear of high-frequency microwave multilayer boards, and it is difficult to ensure high-frequency microwaves. Multilayer board surface flatness and other issues, to avoid scrap, reduce process steps, and avoid agglomeration

Inactive Publication Date: 2022-03-25
深圳市联创电路有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the high-frequency microwave multilayer board may be worn during the grinding process, which may lead to damage and scrap of the high-frequency microwave multilayer board, and this method is also difficult to ensure the flatness of the surface of the high-frequency microwave multilayer board. Therefore, we propose a high-frequency microwave multilayer board. Frequency microwave multi-layer board resin automatic plug hole compaction device and its application method

Method used

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  • High-frequency microwave automatic hole plugging and compacting device for multilayer board resin and using method of high-frequency microwave automatic hole plugging and compacting device
  • High-frequency microwave automatic hole plugging and compacting device for multilayer board resin and using method of high-frequency microwave automatic hole plugging and compacting device
  • High-frequency microwave automatic hole plugging and compacting device for multilayer board resin and using method of high-frequency microwave automatic hole plugging and compacting device

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Embodiment Construction

[0034] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0035]In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific Azimuth configuration and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood a...

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Abstract

The high-frequency microwave multilayer board resin automatic hole plugging and compacting device comprises a base, a liquid storage box is installed at the upper end of the base, a stirring mechanism is arranged at the left end of the liquid storage box and extends into the liquid storage box, and a liquid supplementing opening is formed in the upper portion of the right end of the liquid storage box. A liquid supplementing opening is formed in the upper end of the liquid storage box, a liquid supplementing valve is connected to the middle of the liquid supplementing opening in a sleeving mode, a compaction box is installed at the upper end of the liquid storage box, a compaction mechanism is arranged at the left end of the compaction box and extends into the compaction box, a temperature rising box is installed at the upper end of the compaction box, and a sealing door is rotationally connected to the right portion of the front end of the temperature rising box through a hinge. The compacting mechanism is arranged to simultaneously extrude the resin solution into the high-frequency microwave multilayer board from two directions, liquid filling is uniform, the probability of bubble generation is reduced, the resin solution is recycled by arranging the liquid injection mechanism, the resin solution is continuously stirred by arranging the stirring mechanism, the caking phenomenon is avoided, the automation degree is high, and the production efficiency is high. And the hole plugging quality is high.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a high-frequency microwave multi-layer board resin automatic plug hole compacting device and a use method thereof. Background technique [0002] At present, the operation speed of electronic products is getting faster and higher, and the frequency is getting higher and higher. It has entered the stage of microwave. Microwave is radio wave. Its frequency is higher than that of ordinary radio wave. Many requirements are put forward, such as quality factors such as dielectric constant and characteristic impedance, and the circuit board base material determines the electrical performance of the circuit board. [0003] High-frequency microwave multi-layer boards have higher requirements for the processing accuracy and surface flatness of the circuit boards in order to realize the electrical performance of the high-frequency microwave circuit boards due to the base mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094
Inventor 黄春琴
Owner 深圳市联创电路有限公司
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