High-frequency microwave automatic hole plugging and compacting device for multilayer board resin and using method of high-frequency microwave automatic hole plugging and compacting device
A high-frequency microwave and compaction device technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the damage and scrap of high-frequency microwave multilayer boards, wear and tear of high-frequency microwave multilayer boards, and it is difficult to ensure high-frequency microwaves. Multilayer board surface flatness and other issues, to avoid scrap, reduce process steps, and avoid agglomeration
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[0034] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0035]In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific Azimuth configuration and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood a...
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