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A kind of copper alloy surface polishing liquid and preparation method thereof

A technology of surface polishing and copper alloy, applied in the field of metal polishing liquid, can solve the problems of not being able to combine pickling, polishing, sealing, surface gloss to be improved, over-etching of copper alloy surface, etc., so as to improve the surface scratch repair performance , The effect of stable foaming and uniform dispersion

Active Publication Date: 2022-08-02
广东欣科兴五金制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a copper alloy surface polishing liquid and its preparation method, which is used to solve the problem that the prior art cannot have multiple functions of pickling, polishing, and sealing. After polishing, the surface gloss needs to be improved. Technical problems where over-corrosion occurs

Method used

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  • A kind of copper alloy surface polishing liquid and preparation method thereof
  • A kind of copper alloy surface polishing liquid and preparation method thereof
  • A kind of copper alloy surface polishing liquid and preparation method thereof

Examples

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Embodiment 1

[0030] This embodiment provides a copper alloy surface polishing liquid, which, based on 10 L of polishing liquid, includes 12vt% phosphoric acid, 8vt% sulfuric acid, 40g / L sodium chloride, 0.45g / L compound corrosion inhibitor, 0.23g / L of surfactant, 8vt% methanol, 2.8g / L dodecylphenol polyoxyethylene ether, 28vt% hydrogen peroxide, 5g / L ethanol, and the rest are deionized water.

[0031] The preparation method of the copper alloy surface polishing liquid of the present embodiment comprises the following steps:

[0032] In reactor, add 5kg diethanolamine, 0.9kg quinoline, 21kg deionized water, add 2.8kg thiourea again, be warming up to 92 ℃, add 0.6kg benzotriazole, cocamidopropyl hydroxy after insulation and stirring The sulfobetaine was cooled to room temperature and then added with 0.46kg of sodium molybdate, and stirred at 46°C for 25min to obtain a compound corrosion inhibitor.

[0033] Add 12kg coconut oil acid, 75kg toluene, 0.25kg catalyzer trimethylaluminum successi...

Embodiment 2

[0041] This embodiment provides a copper alloy surface polishing liquid, which, based on 10 L of polishing liquid, includes 9vt% phosphoric acid, 8vt% sulfuric acid, 39g / L sodium chloride, 0.45g / L compound corrosion inhibitor, 0.22g / L of surfactant, 7vt% methanol, 2.8g / L dodecylphenol polyoxyethylene ether, 30vt% hydrogen peroxide, 7g / L ethanol, and the rest are deionized water.

[0042] The preparation method of the copper alloy surface polishing liquid of the present embodiment comprises the following steps:

[0043] In reactor, add 5kg diethanolamine, 1.3kg quinoline, 20kg deionized water, add 2.5kg thiourea again, be warming up to 92 ℃, add 0.7kg benzotriazole, 0.09kg cocamidopropyl after insulation and stirring hydroxysulfobetaine, cooled to room temperature, added 0.09kg of sodium molybdate, kept stirring at 47°C for 27min to obtain a compound corrosion inhibitor.

[0044] Add 12.35kg coconut oil acid, 100kg toluene, 0.36kg catalyzer trimethylaluminum successively in t...

Embodiment 3

[0048] This embodiment provides a copper alloy surface polishing solution, which, according to 10L of polishing solution, includes 14vt% phosphoric acid, 8vt% sulfuric acid, 42g / L sodium chloride, 0.45g / L compound corrosion inhibitor, 0.19g / L of surfactant, 8vt% methanol, 3.2g / L dodecylphenol polyoxyethylene ether, 28vt% hydrogen peroxide, 6g / L ethanol, and the rest are deionized water.

[0049] The preparation method of the copper alloy surface polishing liquid of the present embodiment comprises the following steps:

[0050] In reactor, add 5kg diethanolamine, 1.2kg quinoline, 20kg deionized water, add 3.5kg thiourea again, be warming up to 92 ℃, add 0.8kg benzotriazole, 0.12kg cocamido propane after insulation and stirring hydroxysulfobetaine, cooled to room temperature, added 0.56kg of sodium molybdate, kept stirring at 48°C for 25min to obtain a compound corrosion inhibitor.

[0051] Add 12.70kg coconut oil acid, 110kg toluene, 0.21kg catalyzer trimethylaluminum success...

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Abstract

The invention discloses a copper alloy surface polishing liquid and a preparation method thereof, and relates to the technical field of metal polishing liquids. The polishing liquid of the invention includes phosphoric acid, sulfuric acid, sodium chloride, compound corrosion inhibitor, surfactant, methanol, dodecylphenol polyoxyethylene ether, hydrogen peroxide, ethanol, and the rest are deionized water. During preparation, deionized water is added to the reactor, phosphoric acid and sulfuric acid are added in sequence under mechanical stirring, then sodium chloride, compound corrosion inhibitor, surfactant, dodecylphenol polyoxyethylene ether are added in sequence, and finally hydrogen peroxide is added. , methanol, and ethanol, and obtained after stirring evenly. The main corrosion system of the present invention does not use nitric acid and hydrochloric acid, and will not produce toxic yellow smoke, which will cause harm to the environment and staff, and has three functions of pickling, polishing and sealing at the same time, which reduces the sequential processing of pickling liquid, polishing liquid and sealing liquid. The cost of the copper alloy is high after polishing, and there will be no over-etching phenomenon.

Description

technical field [0001] The invention relates to the technical field of metal polishing liquids, in particular to a copper alloy surface polishing liquid and a preparation method thereof. Background technique [0002] The general process of pickling, polishing and sealing of copper and copper alloys is: pickling with nitric acid and hydrochloric acid mixed solution → polishing with mixed solution of chromic acid, nitric acid, hydrochloric acid, etc. → sealing treatment with chromic acid or chromate solution. The process is to use acid solution to remove the oxide film on the surface of copper and brass parts; and chemical polishing is carried out through the oxidation of copper by acid solutions such as chromic acid and nitric acid and the dissolution of copper by acid solutions such as chromic acid and nitric acid; A method of sealing the surface by chromic acid or chromate, but this method has the following disadvantages in the treatment process: 1. A large amount of nitrog...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F3/06
CPCC09G1/18
Inventor 唐凌松
Owner 广东欣科兴五金制品有限公司
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