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Waterproof structure of high-precision map positioning sensor

A technology of positioning sensor and waterproof structure, which is used in the sealing of instruments, engines, measuring instrument components, etc. It can solve the problems of dampness of equipment and vacuum inside the shell, and achieve low waterproof performance, reliable protection, and excellent waterproof performance. Effect

Pending Publication Date: 2022-03-04
WUHAN KOTEI TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, a sudden drop in temperature caused by a storm may cause a vacuum of 3psi inside the enclosure, which will eventually suck air and water vapor into the device, causing the device to become damp

Method used

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  • Waterproof structure of high-precision map positioning sensor
  • Waterproof structure of high-precision map positioning sensor
  • Waterproof structure of high-precision map positioning sensor

Examples

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Comparison scheme
Effect test

Embodiment Construction

[0038] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0039] This embodiment takes figure 1 The sensor structure shown is an example. refer to figure 1 Description, the sensor structure is composed of aluminum alloy die-casting upper shell 1, lower shell 2, multiple interfaces, PCB components 3, thermal silica gel 18, fasteners, etc. The PCB assembly 3 is composed of three parts: a PCB core board 302 , a PCB main board 301 and a PCB positioning board 303 . The main connector, Ethernet connector, debugging USB port, TF card holder, welding copper stud 19, and other components in multiple interfaces are welded on the PCB main board 301; the FAKRA radio frequency connector 9 is welded on the PCB positioning board 303. The CPU and DDR heating chips are welded on the PCB...

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PUM

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Abstract

The invention relates to a waterproof structure of a high-precision map positioning sensor, the sensor comprises a sealed upper shell, a sealed lower shell and a PCB assembly arranged in the upper shell and / or the lower shell, the PCB assembly is provided with an interface penetrating through the upper shell and / or the lower shell, the joint of the upper shell and the lower shell is provided with a shell waterproof ring used for sealing, and the shell waterproof ring is provided with an interface penetrating through the upper shell and / or the lower shell. A connector waterproof ring used for sealing is arranged between the periphery of the connector and the upper shell and / or the lower shell, a breather valve is arranged on the upper shell and / or the lower shell, and a waterproof breathable film is arranged on the breather valve in a sealed mode. The waterproof structure has excellent waterproof performance, and the waterproof performance of the waterproof structure is slightly influenced by the difference between the internal pressure and the external pressure of the sensor.

Description

technical field [0001] The invention relates to the technical field of automotive electronics, in particular to a waterproof structure of a high-precision map positioning sensor. Background technique [0002] During transportation and use, electronic and electrical products may be exposed to rain from natural precipitation, water droplets from condensation and leakage, similar to the water flushing caused by heavy rain, sprinkler systems, etc., and even flooded by water. Water can damage the coating on the surface of the product, accelerate metal corrosion, and reduce the strength of some materials. It is the main cause of electrical insulation flashover or breakdown, resulting in short circuit damage to the product; water will also penetrate into the product and freeze. Make parts malfunction or fail due to swelling or cracking; water can also cause high humidity, which promotes mold growth, etc. [0003] Existing automotive electronic equipment requires high and low tempe...

Claims

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Application Information

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IPC IPC(8): G01D11/24F16J15/10H05K5/06
CPCG01D11/245F16J15/104F16J15/102H05K5/06
Inventor 苏晓聪华登科祝浪胡守俊张俊
Owner WUHAN KOTEI TECH CORP
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