Preparation method of flexible strain sensor and flexible strain sensor
A strain sensor, flexible technology, applied in the direction of electric/magnetic solid deformation measurement, ion implantation plating, electromagnetic measurement device, etc., can solve the problems of graphene layer damage and pollution, graphene layer cannot be prepared, affect sensor performance, etc. Achieve the effect of reducing measurement error, reducing resistance temperature drift coefficient, and realizing mass production
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0047] see figure 1 , an embodiment of the present invention provides a method for preparing a flexible strain sensor, comprising the following steps:
[0048] Step S10 , preparing a thin film insulating layer 20 on the flexible substrate 10 .
[0049] Step S20 , forming a first carbon layer 30 on one side of the insulating film layer 20 .
[0050] Step S30 , forming a catalytic metal layer 40 on a side of the first carbon layer 30 away from the thin film insulating layer 20 .
[0051] Step S40 , forming a second carbon layer 50 on a side of the catalytic metal layer 40 away from the first carbon layer 30 .
[0052] Step S50 , performing an annealing process to form multi-layer graphene between the flexible substrate 10 and the catalytic metal layer 40 .
[0053] Wherein, the first carbon layer, the catalytic metal layer and the second carbon layer have the same shape and are stacked in sequence, and the first carbon layer, the catalytic metal layer and the second carbon la...
Embodiment 1
[0082] 1. Prepare a flexible substrate (with a thickness of 0.5 mm and a surface roughness below 200 nanometers). The substrate material is polyimide. The substrate is cleaned and dried by ultrasonic waves of acetone, ethanol, and deionized water in sequence.
[0083] 2. Put the flexible substrate into the deposition chamber of the RF magnetron sputtering deposition equipment to grow SiO 2 Thin film insulation. The process parameters are set as follows: choose Si target material, oxygen flow rate is 10sccm, working pressure is 1Pa, sputtering power is 500W, background vacuum degree is 1.0×10 -3 Pa, the sputtering time is 20min, and the growth temperature is 25°C. Finally, SiO 2 The thickness of the thin film insulating layer is 300nm.
[0084] 3. On SiO 2 The first mask plate is pasted on the thin film insulating layer, and it is put into the deposition chamber of the radio frequency magnetron sputtering deposition equipment to grow the first resistance grid structure and ...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com