Three-dimensional heat-conducting and wave-absorbing reinforced composite film and preparation method thereof

An enhanced composite and three-dimensional technology, applied in chemical instruments and methods, manufacturing tools, welding equipment, etc., can solve problems such as low thermal conductivity and electromagnetic shielding efficiency, difficult filling of thermal conductive powder and wave-absorbing powder, and reduction of material strength , to achieve the effect of being conducive to graphene coating, improving the longitudinal thermal conductivity and mechanical strength, and improving the bonding tightness

Active Publication Date: 2022-02-11
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, heat-conducting powder and wave-absorbing powder are often combined with organic silicon to prepare heat-conducting and wave-absorbing products in the market, but heat-conducting powder and wave-absorbing powder are not easy to fill , will lead to low thermal conductivity and electromagnetic shielding effectiveness, and will reduce the strength of the material

Method used

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  • Three-dimensional heat-conducting and wave-absorbing reinforced composite film and preparation method thereof
  • Three-dimensional heat-conducting and wave-absorbing reinforced composite film and preparation method thereof
  • Three-dimensional heat-conducting and wave-absorbing reinforced composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0052] Preparation Example 1 provides a kind of MXene nanosheet, and the following takes Preparation Example 1 as an example to illustrate.

[0053] The MXene nano sheet that preparation example 1 provides, its preparation steps are:

[0054] S1. Add 100g LiF to 500mL HCl solution with a mass fraction of 35wt% for stirring, control the stirring speed to 1000rpm, and stir for 15min to obtain an etching solution containing HF;

[0055] S2. Weigh 80g MAX phase Ti 3 AlC 2 , added to the above HF-containing etching solution to stir, control the stirring speed to 1800rpm, stir for 8h, centrifuge after stirring, wash 3 times with deionized water, and obtain an accordion-shaped MXene multilayer structure;

[0056] S3. Add the above-mentioned accordion-shaped MXene multilayer structure into deionized water for ultrasonication. The ultrasonic time is 10 hours. Control the ultrasonic frequency and ultrasonic power to convert the accordion-shaped MXene multilayer structure into MXene na...

preparation example 2

[0057] Preparation examples 2-4 provide a graphene oxide / MXene thin film, and preparation example 2 is taken as an example to illustrate below.

[0058] The graphene oxide / MXene film that preparation example 2 provides, its preparation steps are:

[0059] S1. Mix 1 g of MXene nanosheets prepared in Preparation Example 1 with 5 L of graphene oxide slurry with a concentration of 1 g / L, and ultrasonically disperse them for 30 min at an ultrasonic power of 200 W to obtain a composite slurry;

[0060] S2. Transfer the above-mentioned composite slurry to a precision coating machine, coat it on the substrate with a thickness of 50 μm, raise the temperature to 100 °C at a rate of 5 °C / min, dry for 2 hours, and then send it into the graphitization furnace. After 30 minutes of argon gas, the temperature in the graphitization furnace was raised to 2500°C, heated at 2500°C for 1 hour, and cooled to room temperature after heating to obtain a graphene oxide / MXene film.

[0061] The differe...

preparation example 2-4

[0062] Table 1 Preparation Example 2-4 The mass ratio of MXene nanosheets to graphene oxide

[0063]

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Abstract

The invention discloses a three-dimensional heat-conducting and wave-absorbing reinforced composite film and a preparation method thereof. The three-dimensional heat-conducting and wave-absorbing reinforced composite film comprises a graphene oxide/MXene film, a plurality of through holes penetrating through the upper surface and the lower surface of the graphene oxide/MXene film are formed in the graphene oxide/MXene film, and graphene-coated nano-diamond particles are arranged in the through holes in a penetrating mode. The preparation method comprises the following steps: S1, mixing the graphene-coated nano diamond particles, the silane coupling agent and the solvent, and ultrasonically dispersing uniformly; s2, performing laser array punching on the graphene oxide/MXene film; and S3, pouring a solution containing the graphene-coated nano diamond particles into the through holes, and drying. The three-dimensional heat-conducting and wave-absorbing reinforced composite film not only has an ultrahigh heat conductivity coefficient in the transverse direction, but also has a relatively high heat conductivity coefficient in the longitudinal direction, and also has good wave-absorbing performance and good mechanical strength.

Description

technical field [0001] The invention relates to the field of heat-conducting and wave-absorbing materials, in particular to a three-dimensional heat-conducting and wave-absorbing reinforced composite film and a preparation method thereof. Background technique [0002] With the advent of the 5G era, electronic products are gradually developing in the direction of lightweight and high integration, resulting in a significant increase in the heat generation of equipment. If the excess heat is not conducted in time, it will greatly affect the working status of electronic components, and even cause failure and shorten the service life in severe cases. In order to meet the needs of high heat conduction, thermal interface materials came into being. Among them, graphene is a new type of carbon material with a single-layer two-dimensional honeycomb lattice structure formed by stacking carbon atoms. It not only has excellent mechanical properties, Optical, electrical and other propert...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B32/28C09K5/14B23K26/382C23C16/26C23C16/44
CPCC01B32/28C09K5/14B23K26/382C23C16/26C23C16/4417Y02P20/10
Inventor 曹勇孙爱祥羊尚强窦兰月周晓燕贺西昌方晓
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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