Inorganic filler high-flux hydroxylation method and device based on low-temperature plasma

Abstract

The invention discloses an inorganic filler high-flux hydroxylation method and a device based on low-temperature plasmas, and the method comprises the following steps: 1) driving a conveyor belt (1) to move by using a roller-to-roller device, and enabling a to-be-treated tiled filler (3) to move to a low-temperature plasma area; 2) enabling a power source to discharge to a low-temperature plasma generator (2) located above the polyimide conveying belt (1); 3) after the plasma generator (2) is electrified, generating atmospheric pressure low-temperature plasma in a low-temperature plasma area; and 4) treating the to-be-treated filler (3) in the plasma area by the atmospheric pressure low-temperature plasma to obtain the filler grafted with the-OH group (hydroxyl). The device comprises the conveyor belt (1), the roller-to-roller device, the power supply, the plasma generator (2), a controller, a temperature measuring device and a discharge power measuring device, the inorganic filler subjected to low-temperature plasma high-flux treatment is good in quality and excellent in grafting effect, no solvent is involved in the whole process, and no toxic by-product is generated.

Description

technical field [0001] The invention relates to the field of material processing, in particular to a low-temperature plasma-based high-throughput hydroxylation method and device for inorganic fillers. Background technique [0002] Inorganic fillers such as boron nitride, aluminum nitride, and graphene have ultra-high thermal conductivity and a wide band gap, so they are excellent thermal conductivity and electrical insulation materials. In actual use, these inorganic fillers also have high chemical stability, heat resistance, oxidation resistance, and low dielectric constant and dielectric loss, so inorganic fillers such as boron nitride, aluminum nitride, and graphene Polymer matrix composites as fillers have broad application prospects in electronic packaging. [0003] The temperature of high-temperature plasma is too high, which makes it difficult to process materials (such as arc discharge plasma and spark discharge plasma, whose macroscopic temperature exceeds 2000 ° C...

AI Technical Summary

Problems solved by technology

However, currently commonly used low-temperature plasma generators often require bulky supporting devices, such as vacuum chambers or high-temperature heating equipment, so they have certain limitations in use

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