Manufacturing method of light-emitting substrate and light-emitting substrate

Abstract

The embodiment of the invention discloses a manufacturing method of a light-emitting substrate and the light-emitting substrate. The manufacturing method of the light-emitting substrate comprises the following steps of forming a plurality of LED chips on a substrate, wherein a spacer region is arranged between every two adjacent LED chips, forming a black photoresist layer on the substrate so as to cover the plurality of LED chips and the plurality of spacer regions, performing first exposure processing on the black photoresist layer to reduce inorganic matters in the black photoresist layer right above the plurality of LED chips, and performing second exposure treatment on the black photoresist layer to cure the black photoresist layer. According to the manufacturing method of the light-emitting substrate, the first exposure treatment is performed on the black photoresist layer to reduce inorganic matters in the black photoresist layer right above the plurality of LED chips, so that the light-emitting brightness of the LED chips is increased, the energy efficiency is improved, and the problem that the light-emitting brightness of the LED chips is not uniform can be solved.

Description

technical field [0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a light-emitting substrate and the light-emitting substrate. Background technique [0002] Micro Led (Micro Light Emitting Diode, Micro Light Emitting Diode) technology has become one of the hot spots of future display technology, and the current LCD (Liquid Crystal Display, Liquid Crystal Display), OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) display devices In comparison, it has the advantages of fast response, high color gamut, high resolution, and low energy consumption; Mini-LED (Mini Light Emitting Diode, small-pitch light-emitting diode), as the product of the combination of Micro-LED and backplane, has high contrast, high The color rendering performance and other features comparable to OLED, the cost is slightly higher than that of LCD, but only about 60% of OLED, and it is easier to implement than Micro-LED a...

AI Technical Summary

Problems solved by technology

[0005] The present application provides a method for manufacturing a light-emitting substrate and the light-emitting substrate. The method for manufacturing the light-emitting substrate pre-cures the black photoresist directly above the LED chip under a mask, so that the black photoresist on the surface of the LED chip is reduced and the black photoresist is increased. The brightness of the LED chip emits light, increases energy efficiency, and solves the problem of uneven brightness of the LED chip.

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