Diamond wire cutting liquid for solar silicon wafer as well as preparation method and application of diamond wire cutting liquid

Abstract

The invention provides diamond wire cutting liquid for a solar silicon wafer as well as a preparation method and application of the diamond wire cutting liquid. The diamond wire cutting liquid for the solar silicon wafer comprises the following components in parts by mass: 10-30 parts of a wetting agent; 15-35 parts of a penetrant; 20-50 parts of a lubricant; 10-0 parts of a sodium-containing compound; and 40-60 parts of pure water. The invention further discloses a preparation method of the diamond wire cutting liquid for the solar silicon wafer. According to the diamond wire cutting liquid, silicon powder in cutting gaps in the cutting process of large-size solar silicon wafers with the size of 182-210 mm can be effectively removed through the combined action of the wetting agent and the penetrant of specific components and compounding of the lubricant, the cutting efficiency is improved, the cutting abnormal rate and the smudginess rate are reduced. The diamond wire cutting liquid has good industrial application prospects and popularization potential in the technical field of solar silicon wafer diamond wire cutting.

Description

technical field [0001] The invention relates to metal cutting fluid technology, in particular to a solar silicon chip diamond wire cutting fluid, its preparation method and application. Background technique [0002] With the continuous development and maturity of solar photovoltaic industry technology, the demand for silicon wafers is growing rapidly. Slicing is the first process of deep processing of silicon wafers, and silicon wafers account for 30-40% of the cost of solar photovoltaic modules, so the improvement of silicon wafer technology is of great significance to reduce the cost of modules. In recent years, the size of silicon wafers has been continuously optimized, and various sizes of silicon wafers such as 158.75mm, 160mm+, 182mm, and 210mm have appeared. The increase and thinning of photovoltaic silicon wafers have become the main technical direction of major manufacturers. Effectively reduce costs and maximize component efficiency. [0003] 182mm and 210mm comp...

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Problems solved by technology

[0006] The object of the present invention is to propose a solar silicon wafer diamond wire cutting fluid for the problem that the traditional diamond wire cutting fluid cannot meet the needs of cutting large-sized silicon wafers. The joint effect and the compounding of lubricants can effectively remove the silicon powder in the cutting gap during the cutting process of large-size silicon wafers of 182-210mm, improve cutting efficiency, reduce cutting abnormality rate and contamination rate, and can be used in diamond wire cutting of solar silicon wafers The technical field has good industrial application prospects and promotion potential

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