High-density interconnection printed circuit board treatment technology and treatment equipment

A printed circuit board, high-density interconnection technology, used in lighting and heating equipment, smoke removal, dryers, etc., can solve the problems of reducing cleaning effect, complicated cleaning process, increasing cleaning cost, etc., to improve cleaning effect, Guaranteed cleaning effect and reduced cleaning effect

Inactive Publication Date: 2021-12-14
朱洁娜
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the production process of existing printed circuit boards, there are many processing procedures. During the processing process, dust and dirt are easily attached to the surface of the printed circuit board, which increases the difficulty of cleaning the printed circuit board, reduces the cleaning effect, and affects the quality of the printed circuit board. Later use, or the cleaning process is complicated, which will increase the cleaning cost, and the economy and practicability are poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-density interconnection printed circuit board treatment technology and treatment equipment
  • High-density interconnection printed circuit board treatment technology and treatment equipment
  • High-density interconnection printed circuit board treatment technology and treatment equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] See Figure 1-6 ,

[0029] Located on top of the base 1 and the cleaning apparatus 2 are both fixedly connected with a support column 9, to facilitate fixing the dust removing device 6 and the drying unit 8, the back support plate 13 is fixedly connected with a fixing plate 15, bottom plate 15 is fixed to the fixed driving connection motor 14, the drive output of the motor 14 is fixedly connected with a rotary shaft penetrating the support plate 13 is 11, the driving motor 14 provides power to drive shaft 11 is rotated, the front support plate 13 defines the through-hole wall 13 front through hole, the support plate defines the welded fixing sleeve 11 provided in the outer wall of the shaft bearing 10, the bearing mounting plate 10 while ensuring the support shaft 11 is rotated 13 does not rotate, both ends of the outer wall of the rotary shaft 11 are fixed sleeve 12 is provided with an electric push rod, the push rod 12 remote from the electric One end of the rotary shaft 1...

Embodiment 2

[0031] See Figure 1-6 ,

[0032] Top of the base 1 and the support post 2 located on the left side of the cleaning means 9 are fixedly connected to the back of the dust removing device 6, the dust removing device 6 comprises a dust box 601 and the purge tank 5, the purge gas to facilitate the discharge of vacuum blower 604, the gas discharged into the air to avoid , the pollution of the environment, the inner wall of the left and right inner walls of dust bins 601 are fixedly connected with the first blower 602, the blower 602 generates a first wind blown off dust on the surface of the printed circuit board, the front and the rear inner wall of the inner wall 601 of the dust box are 604 fixedly connected with a suction fan, the inlet end of the suction fan 604 creates a suction, gas in the vicinity of the tank 601 is sucked into the dust suction fan 604, the discharge end of suction fan 604 are fixedly connected with the tank 601 through dust an exhaust pipe 603, exhaust pipe 603 ...

Embodiment 3

[0034] See Figure 1-6 A high density interconnect printed circuit board processing technology and processing device, comprising a base 1 and the support plate 13, a top of the base 13 and located at the position immediately below the support plate is provided with a cleaning apparatus 2 for cleaning printed circuit boards, cleaning apparatus 2 comprises a base 1 fixed to the top of the cleaning tank 208, washing tank 208 store the cleaning liquid, the bottom of the cleaning tank 208 is fixed to the right side is connected to the first water pump 201, water pump 201 outlet end of the first sleeve provided with a first a pipe 202, a first outlet pipe 202 is provided with a second end sleeve fixed to the top left side of the pump 208 of the cleaning tank 205, the first pump 201, a first pipe 202, a second washing tank 208 and the pump 205 form a loop, to facilitate circulating the cleaning liquid, cleaning liquid flows using a printed circuit board is cleaned to improve the cleaning ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a high-density interconnection printed circuit board treatment technology and treatment equipment. The high-density interconnection printed circuit board treatment equipment comprises a base and a supporting plate, a cleaning device is arranged at the position, located under the supporting plate, at the top of the base, and supporting columns are fixedly connected to the positions, located on the two sides of the cleaning device, at the top of the base. The device structure is simple, the design is novel, dust removal treatment is carried out before a printed circuit board is cleaned, the situation that a large amount of dust enters cleaning liquid, the cleaning liquid is seriously polluted, and the cleaning effect is reduced is avoided, the situation that the cleaning liquid is frequently replaced, and resource waste is caused is avoided, the printed circuit board is cleaned through the flowing cleaning liquid after dust removal is completed, the cleaning effect is improved, after cleaning in a cleaning box is completed, cleaning is carried out again through a sprayer, the cleaning effect is guaranteed, the printed circuit board is dried through hot air after cleaning is completed, the printed circuit board is prevented from being damaged by too high heat, and the high-density interconnection printed circuit board treatment technology and treatment equipment are suitable for wide popularization.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a high-density interconnected printed circuit board processing technology and processing equipment. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made by electronic printing, it is called "printed" circuit board. After electronic equipment uses printed circuit boards, due to the consistency of similar printed circuit boards, it avoids manual wiring errors and can realize Automatic insertion or placement of electronic components, automatic soldering, and automatic detection ensure the quality of electronic equipment, improve labor productivity, reduce costs, and facilitate maintenance. [0003] However, in the production...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B08B5/02B08B3/02B08B3/14B08B15/04F26B21/00F26B23/06
CPCB08B5/02B08B3/02B08B3/14B08B15/04F26B21/00F26B23/06
Inventor 朱洁娜
Owner 朱洁娜
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap