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Circuit board manufacturing method for processing electroplated hole and anti-corrosion pattern by laser

A circuit board method and anti-etching pattern technology, which is applied in the direction of chemical/electrolytic method to remove conductive materials, printed circuit, pattern and photolithography, etc., to achieve the effect of shortening the manufacturing process, fewer steps and high efficiency

Pending Publication Date: 2021-12-07
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] Aiming at the deficiency that the existing technology cannot only electroplate thickened holes, the present invention has developed a new manufacturing method, and the technical scheme of the present invention is as follows:

Method used

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  • Circuit board manufacturing method for processing electroplated hole and anti-corrosion pattern by laser
  • Circuit board manufacturing method for processing electroplated hole and anti-corrosion pattern by laser
  • Circuit board manufacturing method for processing electroplated hole and anti-corrosion pattern by laser

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Experimental program
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Effect test

Embodiment 1

[0076] Copper-clad laminates are commonly used as the basic material to make circuit boards in the electronics industry. The copper-clad laminates include an insulating substrate 1 and a copper-clad laminate copper layer 2 .

[0077] This embodiment takes a double-sided printed circuit board as an example, and the specific processing steps are as follows:

[0078] (1) The circuit board base material copper clad laminate includes an insulating substrate 1 and a copper clad laminate 2. The copper clad laminate is drilled, and the initial conductive layer 3 is deposited on the product in process of the double-sided circuit board that has been drilled, and the copper is electroplated to The thickness can withstand subsequent processes to form electroplated thin copper 4 .

[0079] The purpose of making thin copper on the initial conductive layer is to increase the reliability of the manufacturing process, and its thickness should reach the lower limit to ensure the reliability of ...

Embodiment 2

[0114] Copper-clad laminates are commonly used as the basic material to make circuit boards in the electronics industry. The copper-clad laminates include an insulating substrate 1 and a copper-clad laminate copper layer 2 .

[0115] In this embodiment, a four-layer circuit board whose inner circuit has been fabricated is taken as an example, and the specific processing steps are as follows:

[0116] (1) The circuit board base material copper-clad laminate includes an insulating substrate 1 and a copper-clad laminate copper layer 2. The drilled copper-clad laminate is completed, and the initial conductive layer 3 is deposited on the finished product of the four-layer circuit board that has been drilled, and copper is electroplated to The thickness can withstand subsequent processes to form electroplated thin copper 4 .

[0117] Electroless copper is deposited on the four-layer circuit board that has been drilled and the inner layer circuit is completed, and copper is electropl...

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Abstract

The invention relates to a circuit board manufacturing method for processing an electroplated hole and an anti-corrosion pattern by laser, which comprises the following steps of: drilling, depositing a thin metal layer on the hole and a board surface, pasting a non-photosensitive masking film, removing the masking layer covering the hole wall by using laser to expose the hole wall, only electroplating and thickening a conductive layer in the hole, only electroplating a metal anti-corrosion agent in the hole, and manufacturing the anti-corrosion pattern by using the laser. A conductive pattern is etched, a non-photosensitive solder resist is coated on a non-circuit area, a solder resist pattern is manufactured by laser on an assembly site, and cleaning and weldability treatment are carried out on the surface of a welding area; the manufacturing process of the circuit board can be integrally optimized and shortened, a non-photosensitive material is used as an anti-electroplating material, only a conductive layer in the hole is electroplated and thickened, only anti-corrosion and weldable metal is electroplated on the hole wall, and an electroplating hole pattern, an anti-etching pattern and a solder mask pattern are manufactured step by step by using laser, so that the steps are few, the cost is low, and a finer circuit board is manufactured; the quality and the efficiency are improved. The method is suitable for large-batch or small-batch and multi-variety manufacturing of various circuit boards or circuit board samples.

Description

technical field [0001] The invention relates to a circuit board manufacturing method for processing electroplated holes and anti-corrosion patterns by laser, using non-photosensitive material as a masking film, and only electroplating and thickening the conductive layer in the hole, belonging to the technical field of circuit board production. Background technique [0002] In today's world, electronics are everywhere. Among them, one of the most important parts is the circuit board, which is the electrical connection channel between various components, which determines the respective electrical parameters and electrical logic relations; at the same time, it is also the installation and fixed carrier of each component, and is the skeleton. [0003] In terms of space, the electrical connections on the circuit board can be divided into two groups: the connection in the horizontal direction, that is, the part usually called the conductive pattern, is on the plane of each layer,...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K3/06H05K3/28C25D7/00C25D5/02C23F1/02
CPCH05K3/42H05K3/061H05K3/28C25D5/022C25D7/00C23F1/02H05K2203/108H05K2203/0548
Inventor 胡宏宇宋金月
Owner 德中(天津)技术发展股份有限公司
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