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Circuit board manufacturing method for processing plating-resistant and conductive patterns of electroplating holes by laser

A conductive pattern and laser processing technology, which is applied in the direction of assembling printed circuits, printed circuits, and printed circuit manufacturing of electrical components, to achieve good electroplating resistance, cost reduction, and environmental friendliness

Pending Publication Date: 2021-11-23
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] Aiming at the deficiency that the existing technology cannot only electroplate thickened holes, the present invention has developed a new manufacturing method, and the technical scheme of the present invention is as follows:

Method used

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  • Circuit board manufacturing method for processing plating-resistant and conductive patterns of electroplating holes by laser
  • Circuit board manufacturing method for processing plating-resistant and conductive patterns of electroplating holes by laser
  • Circuit board manufacturing method for processing plating-resistant and conductive patterns of electroplating holes by laser

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Experimental program
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Effect test

Embodiment 1

[0081] Copper-clad laminates are commonly used as the basic material to make circuit boards in the electronics industry. The copper-clad laminates include an insulating substrate 1 and a copper-clad laminate copper layer 2 .

[0082] This embodiment takes a double-sided printed circuit board as an example, and the specific processing steps are as follows:

[0083] (1) The circuit board base material copper clad laminate includes an insulating substrate 1 and a copper clad laminate 2. The copper clad laminate is drilled, and the initial conductive layer 3 is deposited on the product in process of the double-sided circuit board that has been drilled, and the copper is electroplated to The thickness can withstand subsequent processes to form electroplated thin copper 4 . ;

[0084] The purpose of making thin copper on the initial conductive layer is to increase the reliability of the manufacturing process, and its thickness should reach the lower limit to ensure the reliability ...

Embodiment 2

[0115] Copper-clad laminates are commonly used as the basic material to make circuit boards in the electronics industry. The copper-clad laminates include an insulating substrate 1 and a copper-clad laminate copper layer 2 .

[0116] In this embodiment, a four-layer circuit board whose inner circuit has been fabricated is taken as an example, and the specific processing steps are as follows:

[0117] (1) The circuit board base material copper-clad laminate includes an insulating substrate 1 and a copper-clad laminate copper layer 2. The drilled copper-clad laminate is completed, and the initial conductive layer 3 is deposited on the finished product of the four-layer circuit board that has been drilled, and copper is electroplated to The thickness can withstand subsequent processes to form electroplated thin copper 4 .

[0118] The purpose of making thin copper on the initial conductive layer is to increase the reliability of the manufacturing process, and its thickness should...

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Abstract

The invention relates to a circuit board manufacturing method for processing plating-resistant and conductive patterns of electroplated holes. The method comprises the following steps: drilling, depositing a thin metal layer on the holes and a board surface, pasting a non-photosensitive masking film, removing the masking layer covering the hole walls by laser to expose the hole walls, only electroplating and thickening conductive layers in the holes, electroplating weldable metal on the hole walls, and using laser to guide the patterns; and coating a non-photosensitive solder resist on the non-circuit area, manufacturing a solder resist pattern by using laser on an assembly site, and carrying out cleaning and weldability treatment on the surface of a welding area. The manufacturing process of the circuit board can be integrally optimized and shortened, the quality and the efficiency are improved, the cost is reduced, and the method is environment-friendly. A non-photosensitive material is used as an anti-electroplating material, only a conductive layer in a hole is electroplated and thickened, only weldable metal is electroplated on a hole wall, and an electroplating hole pattern, a conductive pattern and a solder mask pattern are manufactured by laser, so that the steps are few, the cost is low, and a finer circuit board can be manufactured. The method is suitable for large-batch production of various circuit boards, and is also suitable for small-batch and multi-variety production of circuit board samples.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board by laser processing electroplated holes with anti-plating and conductive patterns, which directly and selectively removes materials and only electroplates holes, and belongs to the technical field of circuit board production. Background technique [0002] The invention uses laser direct material removal technology to manufacture circuit boards, can only electroplate hole walls, and directly manufacture solder resist and conductive patterns without pattern transfer process. [0003] The manufacturing process is as follows: Deposit the initial conductive layer on the finished product of the double-sided, multi-layer circuit board that has been drilled, electroless plating or electroplating thin copper → paste the anti-plating masking film → laser remove the anti-plating mask on the hole area The film layer opens a window for the chemical liquid to enter the hole, and makes the pattern of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/34H05K3/02
CPCH05K3/0026H05K3/423H05K3/425H05K3/3447H05K3/02
Inventor 胡宏宇宋金月
Owner 德中(天津)技术发展股份有限公司
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