Self-sealing connection type super-aerophobic immersed phase-change liquid-cooling reinforced heat dissipation plate, preparation method and application thereof

Abstract

The invention discloses a self-sealing connection type super-aerophobic immersed phase-change liquid-cooling reinforced heat dissipation plate, which is characterized in that the surface of the reinforced heat dissipation plate comprises a first area and a second area, micron mastoid arrays are distributed on the surface of the reinforced heat dissipation plate in the first area, micron mastoid arrays are distributed on the surface of the reinforced heat dissipation plate in the second area, liquid-state metal is packaged in gaps of the micron mastoid arrays, the contact area of the reinforced heat dissipation plate and a heating device comprises the second area, the first area of the reinforcedheat dissipation plate comprises a large-area super-aerophobic reinforcedboiling structure so as to remarkably promoteliquid-gas phase change and improve the liquid cooling heat dissipation performance, and the second area has a gap self-filling type sealing connection function, so that the contact thermal resistance with the heating device can be greatly reduced, and the interface heat conduction efficiency is improved. According to the invention, the reinforced heat dissipation plate is low in cost, convenient to assemble and disassemble, stable in performance and simple in preparation process, and has a good application prospect in the fields of data center servers, aerospace thermal control equipment, advanced power batteries and the like.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment. More specifically, it relates to a self-adhesive super-air-repellent submerged phase-change liquid-cooled enhanced heat dissipation plate. Background technique [0002] With the progress and development of the microelectronics industry, the demand for cooling and heat dissipation of high-heat-density devices is increasing year by year. The immersion phase-change liquid cooling technology has begun to replace the traditional air-cooling method that relies on air cooling, and is expected to become a data center server in the future (application announced CN 104597994 A, CN 106774741 A), aerospace thermal control equipment (application publication numbers CN110213934 A, CN 112013427 A) and advanced power batteries (application publication numbers CN 110729526 A, CN111883876 A) and other fields. [0003] Immersion phase change liquid cooling is to completely immerse the solid heat...

AI Technical Summary

Problems solved by technology

However, the reported enhanced heat dissipation components at most involve using the surface of sintered copper particles to enhance the boiling of refrigerant (application publication number CN 107894823 A), and have not paid attention to the contact thermal resistance of heating devices, which usually need to rely on additional thermal interface materials (such as thermal grease, thermal pad, thermal adhesive, thermal paste, phase change material, graphite sheet, etc.)

However, even the most advanced liquid metal thermal interface materials (application publication numbers CN 106929733 A, CN 107052308 A, CN 110330943 A), the thermal conductivity has not exceeded 100W m - 1 K -1 , much lower than that of solid metal materials (such as copper with a thermal conductivity of about 400W m -1 K -1 )

This kind of peripheral thermal interface not only increases the cost, but also brings assembly difficulty and operation and maintenance risks: once the assembly process fails to completely exclude the air at the contact interface (the thermal conductivity is only about 0.024Wm -1 K -1 ), it will greatly increase the thermal resistance and block cooling and heat dissipation; once the complex components in the thermal interface (many conductive metal-doped particles) gradually lose into the cold medium, it will not only destroy the properties of the refrigerant, reduce the energy efficiency of liquid cooling, and cause electronic The hidden worry of device short circuit or even system failure

In addition, the existing sintered copper particle (application publication number CN 107894823 A) enhanced heat dissipation scheme has disadvantages such as complicated procedures, high energy consumption, limited actual processing area, and lack of precise control of structure and shape.

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