Method and device for eliminating contamination on surface of object

A technology of object surface and gas molecules, which is applied in the field of eliminating contamination on the surface of objects, and can solve problems such as many by-products, surface damage of high-energy electrons, and complex application conditions

Active Publication Date: 2021-11-16
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned defects existing in the prior art, the object of the present invention is to provide a method and device for eliminating contamination on the surface of an object, which solves the need for miniaturization, modularization and integration of systems in the treatment of surface contamination by electron beams Furthermore, it solves the problems of surface damage and backsputter deposition of high-energy electrons in electron beam processing technology in the case of incomplete contamination, as well as the problems of many by-products and complex application conditions, and realizes surface purification and surface state protection at the same time

Method used

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  • Method and device for eliminating contamination on surface of object
  • Method and device for eliminating contamination on surface of object
  • Method and device for eliminating contamination on surface of object

Examples

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Effect test

Embodiment 1

[0075] This embodiment provides a method for eliminating surface contamination. Exemplarily, this method can be used as figure 1 A contaminated surface treatment device is shown, but the present invention is not particularly limited to the structure of the device needed to implement the method. The device includes: a low-energy electron source 01, a control component 02 and a structured atmosphere control component 04;

[0076] The low-energy electron source 01 is installed on the deployment control component 02, and the deployment control component 02 is located above the contaminated surface;

[0077] The low-energy electron source 01 includes a free electron emission structure 011, a multilevel field emission electron window 012 and a vacuum packaging structure 013; there is a gap between the free electron emission structure 011 and the multilevel field emission electron window 012; the vacuum packaging structure 013 is used for Ensure that the gap between the free electr...

Embodiment 2

[0088] Such as figure 2 The shown device for eliminating surface contamination includes the following components: a low-energy electron source 01, a control component 02, and an electric field regulation functional structure 03, wherein,

[0089] The low-energy electron source 01 includes a free electron emission structure 011, a multi-level field emission electron window 012, a vacuum packaging structure 013,

[0090] There is a gap of 1 mm between the free electron emission structure 011 and the multi-level field emission electron window 012, which is maintained by a perforated quartz round platform. The vacuum packaging structure 013 is assembled from a dielectric material cavity and a flange plate, with a diameter of about 32 mm, the gap between the free electron emission source 011 and the field emission electron window 012 is achieved and maintained by a mechanical pump and a molecular pump to form a 1×10 -3 Pa low pressure environment,

[0091] The free electron emis...

Embodiment 3

[0100] A device for eliminating surface contamination, including the following components: a low-energy electron source 01, a control component 02, and an electric field regulation functional structure 03, wherein,

[0101] The low-energy electron source 01 includes a free electron emission structure 011, a multi-level field emission electron window 012, a vacuum packaging structure 013,

[0102] There is a gap of about 10 mm between the free electron emission structure 011 and the multi-level field emission electron window 012, which is maintained by a perforated quartz round platform. The vacuum packaging structure 013 is formed by welding a ceramic cavity with a Kovar alloy and a metal packaging plate, with a diameter of About 32 mm, the gap formation between the free electron emission source 011 and the field emission electron window 012 is achieved and maintained by the getter below 1×10 -3 Pa low pressure environment,

[0103] The free electron emission structure 011 is...

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PUM

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Abstract

The invention discloses a method and device for eliminating contamination on a surface of an object. The method comprises the steps of emitting free electrons; generating a free electron accelerating electric field to accelerate the emitted free electrons; generating a free electron collision process modulation electric field, controlling part of free electrons to interact with gas molecules in the modulation electric field to generate a collision ionization process, and generating collision ionization free electrons; and controlling the free electrons and the collision ionization free electrons step by step to act on the contaminated surface together. According to the method of the invention, the energy requirement of free electrons penetrating through an interface between a high-vacuum area and a complex atmosphere where the contaminated surface is located is reduced through a field emission process, and effective penetration of low-energy free electrons can be realized through a graded and regional structural design; and the time-varying process and the action sequence of electron energy around the contaminated substance are controlled by constructing accelerating electric fields in different states step by step and adjusting the air pressure.

Description

technical field [0001] The invention belongs to the fields of surface cleaning technology, contaminated surface disinfection technology, vacuum electron technology, gas electron technology, plasma technology, electron beam technology, etc., and specifically relates to a method and device for eliminating contamination on the surface of an object. Background technique [0002] Solid surfaces often have contamination problems, and electron beams are widely used in high-level surface contamination cleaning technologies. Typical examples include: First, in the application of logistics packaging cleaning, surface pathogenic microbial contamination has become an important source of infectious diseases However, pathogenic microorganisms such as viruses and bacteria are small in size and usually have a low proportion of the area of ​​the contaminated area, and the cleaning process usually requires rapid completion. However, microorganisms are highly resistant to stress. Commonly used...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B08B13/00
CPCB08B7/0035B08B13/00
Inventor 侯中宇丁衡高房茂波田遵义
Owner SHANGHAI JIAO TONG UNIV
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